An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package

Hiroki Ishikuro, Toshihiko Sugahara, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

35 Citations (Scopus)

Abstract

A wireless logic-probing system is presented as one of the applications of the millimeter-range carrierless inductive-coupling technique. A pulse transceiver for a wireless probe and its target LSI is fabricated using a 0.25μm standard CMOS logic process. A maximum data rate of 20Mb/s and a communication range of 1.2mm is achieved.

Original languageEnglish
Title of host publicationDigest of Technical Papers - IEEE International Solid-State Circuits Conference
DOIs
Publication statusPublished - 2007
Event54th IEEE International Solid-State Circuits Conference, ISSCC 2007 - San Francisco, CA, United States
Duration: 2007 Feb 112007 Feb 15

Other

Other54th IEEE International Solid-State Circuits Conference, ISSCC 2007
CountryUnited States
CitySan Francisco, CA
Period07/2/1107/2/15

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Transceivers
Communication

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

Cite this

An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package. / Ishikuro, Hiroki; Sugahara, Toshihiko; Kuroda, Tadahiro.

Digest of Technical Papers - IEEE International Solid-State Circuits Conference. 2007. 4242414.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ishikuro, H, Sugahara, T & Kuroda, T 2007, An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package. in Digest of Technical Papers - IEEE International Solid-State Circuits Conference., 4242414, 54th IEEE International Solid-State Circuits Conference, ISSCC 2007, San Francisco, CA, United States, 07/2/11. https://doi.org/10.1109/ISSCC.2007.373443
Ishikuro, Hiroki ; Sugahara, Toshihiko ; Kuroda, Tadahiro. / An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package. Digest of Technical Papers - IEEE International Solid-State Circuits Conference. 2007.
@inproceedings{89a306148a904800becac6523389e33b,
title = "An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package",
abstract = "A wireless logic-probing system is presented as one of the applications of the millimeter-range carrierless inductive-coupling technique. A pulse transceiver for a wireless probe and its target LSI is fabricated using a 0.25μm standard CMOS logic process. A maximum data rate of 20Mb/s and a communication range of 1.2mm is achieved.",
author = "Hiroki Ishikuro and Toshihiko Sugahara and Tadahiro Kuroda",
year = "2007",
doi = "10.1109/ISSCC.2007.373443",
language = "English",
isbn = "1424408539",
booktitle = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",

}

TY - GEN

T1 - An attachable wireless chip access interface for arbitrary data rate using pulse-based inductive-coupling through LSI package

AU - Ishikuro, Hiroki

AU - Sugahara, Toshihiko

AU - Kuroda, Tadahiro

PY - 2007

Y1 - 2007

N2 - A wireless logic-probing system is presented as one of the applications of the millimeter-range carrierless inductive-coupling technique. A pulse transceiver for a wireless probe and its target LSI is fabricated using a 0.25μm standard CMOS logic process. A maximum data rate of 20Mb/s and a communication range of 1.2mm is achieved.

AB - A wireless logic-probing system is presented as one of the applications of the millimeter-range carrierless inductive-coupling technique. A pulse transceiver for a wireless probe and its target LSI is fabricated using a 0.25μm standard CMOS logic process. A maximum data rate of 20Mb/s and a communication range of 1.2mm is achieved.

UR - http://www.scopus.com/inward/record.url?scp=34548847971&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34548847971&partnerID=8YFLogxK

U2 - 10.1109/ISSCC.2007.373443

DO - 10.1109/ISSCC.2007.373443

M3 - Conference contribution

AN - SCOPUS:34548847971

SN - 1424408539

SN - 9781424408535

BT - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

ER -