An extended XY coil for noise reduction in inductive-coupling link

Mitsuko Saito, Kazutaka Kasuga, Tsutomu Takeya, Noriyuki Miura, Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    13 Citations (Scopus)

    Abstract

    Inductive-coupling link between stacked chips in a package communicates by using coils made by on-chip Interconnections. An XY-coil layout style allows logic interconnections to go through the coil, which significantly saves Interconnection resources consumed by the coil. However, the logic interconnections generate capacitive-coupling noise on the coil and degrade signal in the inductive-coupling link. In this paper, an extended XY coil with ground shields is presented for noise reduction. Simulation study shows that the noise voltage is reduced to 1/5 of the conventional XY coil. This noise reduction enables to reduce transmit power required for the same BER. Test-chip measurement in 0.18μm CMOS demonstrates that the transmit power at 1Gb/s with BER<10-12 is reduced by 60% compared to the conventional XY coil.

    Original languageEnglish
    Title of host publicationProceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009
    Pages305-308
    Number of pages4
    DOIs
    Publication statusPublished - 2009 Dec 1
    Event2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009 - Taipei, Taiwan, Province of China
    Duration: 2009 Nov 162009 Nov 18

    Publication series

    NameProceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009

    Conference

    Conference2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009
    CountryTaiwan, Province of China
    CityTaipei
    Period09/11/1609/11/18

    ASJC Scopus subject areas

    • Hardware and Architecture
    • Electrical and Electronic Engineering

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  • Cite this

    Saito, M., Kasuga, K., Takeya, T., Miura, N., & Kuroda, T. (2009). An extended XY coil for noise reduction in inductive-coupling link. In Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009 (pp. 305-308). [5357248] (Proceedings of Technical Papers - 2009 IEEE Asian Solid-State Circuits Conference, A-SSCC 2009). https://doi.org/10.1109/ASSCC.2009.5357248