An image sensor/processor 3D stacked module featuring ThruChip interfaces

Masayuki Ikebe, Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Daisuke Uchida, Yasuhiro Take, Tadahiro Kuroda, Masato Motomura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

1,000 fps motion vector (MV) estimation and classification engine for highspeed computational imaging in a 3D stacked imager/processor module is proposed, prototyped, assembled, and also tested. The module features 1) ThruChip interfaces for high fps image transfer, 2) orders of magnitude more area/power efficient MV estimation architecture compared to conventional ones, and 3) a cognitive classification scheme employed on MV patterns, enabling the classification of moving objects not possible in conventional proposals.

Original languageEnglish
Title of host publication2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages7-8
Number of pages2
ISBN (Electronic)9781509015580
DOIs
Publication statusPublished - 2017 Feb 16
Event22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017 - Chiba, Japan
Duration: 2017 Jan 162017 Jan 19

Other

Other22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017
CountryJapan
CityChiba
Period17/1/1617/1/19

Fingerprint

Image sensors
Engines
Imaging techniques

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design

Cite this

Ikebe, M., Asai, T., Mori, M., Itou, T., Uchida, D., Take, Y., ... Motomura, M. (2017). An image sensor/processor 3D stacked module featuring ThruChip interfaces. In 2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017 (pp. 7-8). [7858275] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASPDAC.2017.7858275

An image sensor/processor 3D stacked module featuring ThruChip interfaces. / Ikebe, Masayuki; Asai, Tetsuya; Mori, Masafumi; Itou, Toshiyuki; Uchida, Daisuke; Take, Yasuhiro; Kuroda, Tadahiro; Motomura, Masato.

2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 7-8 7858275.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ikebe, M, Asai, T, Mori, M, Itou, T, Uchida, D, Take, Y, Kuroda, T & Motomura, M 2017, An image sensor/processor 3D stacked module featuring ThruChip interfaces. in 2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017., 7858275, Institute of Electrical and Electronics Engineers Inc., pp. 7-8, 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017, Chiba, Japan, 17/1/16. https://doi.org/10.1109/ASPDAC.2017.7858275
Ikebe M, Asai T, Mori M, Itou T, Uchida D, Take Y et al. An image sensor/processor 3D stacked module featuring ThruChip interfaces. In 2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 7-8. 7858275 https://doi.org/10.1109/ASPDAC.2017.7858275
Ikebe, Masayuki ; Asai, Tetsuya ; Mori, Masafumi ; Itou, Toshiyuki ; Uchida, Daisuke ; Take, Yasuhiro ; Kuroda, Tadahiro ; Motomura, Masato. / An image sensor/processor 3D stacked module featuring ThruChip interfaces. 2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 7-8
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