An image sensor/processor 3D stacked module featuring ThruChip interfaces

Masayuki Ikebe, Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Daisuke Uchida, Yasuhiro Take, Tadahiro Kuroda, Masato Motomura

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    1 Citation (Scopus)

    Abstract

    1,000 fps motion vector (MV) estimation and classification engine for highspeed computational imaging in a 3D stacked imager/processor module is proposed, prototyped, assembled, and also tested. The module features 1) ThruChip interfaces for high fps image transfer, 2) orders of magnitude more area/power efficient MV estimation architecture compared to conventional ones, and 3) a cognitive classification scheme employed on MV patterns, enabling the classification of moving objects not possible in conventional proposals.

    Original languageEnglish
    Title of host publication2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages7-8
    Number of pages2
    ISBN (Electronic)9781509015580
    DOIs
    Publication statusPublished - 2017 Feb 16
    Event22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017 - Chiba, Japan
    Duration: 2017 Jan 162017 Jan 19

    Other

    Other22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017
    CountryJapan
    CityChiba
    Period17/1/1617/1/19

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Computer Science Applications
    • Computer Graphics and Computer-Aided Design

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  • Cite this

    Ikebe, M., Asai, T., Mori, M., Itou, T., Uchida, D., Take, Y., Kuroda, T., & Motomura, M. (2017). An image sensor/processor 3D stacked module featuring ThruChip interfaces. In 2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017 (pp. 7-8). [7858275] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASPDAC.2017.7858275