An inductive-coupling bus with collision detection scheme using magnetic field variation for 3-D network-on-chips

Junichiro Kadomoto, Tomoki Miyata, Hideharu Amano, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

A wireless vertical bus with collision detection scheme for 3-D network-on-chips (NoC) is presented. Utilizing inductive-coupling between coils, wireless connection between all stacked chips is established. Data collision is detected by sensing magnetic field variation. A test chip is fabricated in 65 nm SOI CMOS technology. A data rate of 0.8 Gb/s with a BER < 10-12 is achieved. The energy efficiency is better than 1.4 pJ/b. A collision detection circuit is implemented and its operation is confirmed.

Original languageEnglish
Title of host publication2016 IEEE Asian Solid-State Circuits Conference, A-SSCC 2016 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages41-44
Number of pages4
ISBN (Electronic)9781509037001
DOIs
Publication statusPublished - 2017 Feb 6
Event12th IEEE Asian Solid-State Circuits Conference, A-SSCC 2016 - Toyama, Japan
Duration: 2016 Nov 72016 Nov 9

Other

Other12th IEEE Asian Solid-State Circuits Conference, A-SSCC 2016
CountryJapan
CityToyama
Period16/11/716/11/9

Keywords

  • 3-D integration
  • collision detection
  • inductive-coupling bus
  • Network-on-chips (NoC)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

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  • Cite this

    Kadomoto, J., Miyata, T., Amano, H., & Kuroda, T. (2017). An inductive-coupling bus with collision detection scheme using magnetic field variation for 3-D network-on-chips. In 2016 IEEE Asian Solid-State Circuits Conference, A-SSCC 2016 - Proceedings (pp. 41-44). [7844130] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASSCC.2016.7844130