An inductive-coupling link for 3-D Network-on-Chips

Junichiro Kadomoto, Hideharu Amano, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An inductive-coupling link for 3-D network-on-chips (NoC) is presented. Inductively coupled coils allow high-speed wireless communication between stacked chips. 35-bit parallel input data are serialized and transmitted. Silicon measurements from test chips implementing transceiver circuits, in 65 nm SOI CMOS technology demonstrate 875 Mb/s operation.

Original languageEnglish
Title of host publicationProceedings - International SoC Design Conference 2017, ISOCC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages150-151
Number of pages2
ISBN (Electronic)9781538622858
DOIs
Publication statusPublished - 2018 May 29
Event14th International SoC Design Conference, ISOCC 2017 - Seoul, Korea, Republic of
Duration: 2017 Nov 52017 Nov 8

Publication series

NameProceedings - International SoC Design Conference 2017, ISOCC 2017

Other

Other14th International SoC Design Conference, ISOCC 2017
CountryKorea, Republic of
CitySeoul
Period17/11/517/11/8

Keywords

  • 3-D integration
  • Inductive-coupling link
  • Network-on-chips (NoC)

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Kadomoto, J., Amano, H., & Kuroda, T. (2018). An inductive-coupling link for 3-D Network-on-Chips. In Proceedings - International SoC Design Conference 2017, ISOCC 2017 (pp. 150-151). (Proceedings - International SoC Design Conference 2017, ISOCC 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2017.8368841