Abstract
An inductive-coupling link for 3-D network-on-chips (NoC) is presented. Inductively coupled coils allow high-speed wireless communication between stacked chips. 35-bit parallel input data are serialized and transmitted. Silicon measurements from test chips implementing transceiver circuits, in 65 nm SOI CMOS technology demonstrate 875 Mb/s operation.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - International SoC Design Conference 2017, ISOCC 2017 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 150-151 |
| Number of pages | 2 |
| ISBN (Electronic) | 9781538622858 |
| DOIs | |
| Publication status | Published - 2018 May 29 |
| Event | 14th International SoC Design Conference, ISOCC 2017 - Seoul, Korea, Republic of Duration: 2017 Nov 5 → 2017 Nov 8 |
Other
| Other | 14th International SoC Design Conference, ISOCC 2017 |
|---|---|
| Country | Korea, Republic of |
| City | Seoul |
| Period | 17/11/5 → 17/11/8 |
Keywords
- 3-D integration
- Inductive-coupling link
- Network-on-chips (NoC)
ASJC Scopus subject areas
- Hardware and Architecture
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
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Cite this
Kadomoto, J., Amano, H., & Kuroda, T. (2018). An inductive-coupling link for 3-D Network-on-Chips. In Proceedings - International SoC Design Conference 2017, ISOCC 2017 (pp. 150-151). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2017.8368841