An inductive-coupling link for 3-D Network-on-Chips

Junichiro Kadomoto; Hideharu Amano; Tadahiro Kuroda

doi:10.1109/ISOCC.2017.8368841

An inductive-coupling link for 3-D Network-on-Chips

Junichiro Kadomoto, Hideharu Amano, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

An inductive-coupling link for 3-D network-on-chips (NoC) is presented. Inductively coupled coils allow high-speed wireless communication between stacked chips. 35-bit parallel input data are serialized and transmitted. Silicon measurements from test chips implementing transceiver circuits, in 65 nm SOI CMOS technology demonstrate 875 Mb/s operation.

Original language	English
Title of host publication	Proceedings - International SoC Design Conference 2017, ISOCC 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	150-151
Number of pages	2
ISBN (Electronic)	9781538622858
DOIs	https://doi.org/10.1109/ISOCC.2017.8368841
Publication status	Published - 2018 May 29
Event	14th International SoC Design Conference, ISOCC 2017 - Seoul, Korea, Republic of Duration: 2017 Nov 5 → 2017 Nov 8

Other

Other	14th International SoC Design Conference, ISOCC 2017
Country	Korea, Republic of
City	Seoul
Period	17/11/5 → 17/11/8

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Keywords

3-D integration
Inductive-coupling link
Network-on-chips (NoC)

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Cite this

Kadomoto, J., Amano, H., & Kuroda, T. (2018). An inductive-coupling link for 3-D Network-on-Chips. In Proceedings - International SoC Design Conference 2017, ISOCC 2017 (pp. 150-151). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2017.8368841

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Access to Document

10.1109/ISOCC.2017.8368841