An inductive-coupling link for 3-D Network-on-Chips

Junichiro Kadomoto, Hideharu Amano, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

An inductive-coupling link for 3-D network-on-chips (NoC) is presented. Inductively coupled coils allow high-speed wireless communication between stacked chips. 35-bit parallel input data are serialized and transmitted. Silicon measurements from test chips implementing transceiver circuits, in 65 nm SOI CMOS technology demonstrate 875 Mb/s operation.

Original languageEnglish
Title of host publicationProceedings - International SoC Design Conference 2017, ISOCC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages150-151
Number of pages2
ISBN (Electronic)9781538622858
DOIs
Publication statusPublished - 2018 May 29
Event14th International SoC Design Conference, ISOCC 2017 - Seoul, Korea, Republic of
Duration: 2017 Nov 5 → 2017 Nov 8

Other

Other14th International SoC Design Conference, ISOCC 2017
CountryKorea, Republic of
CitySeoul
Period17/11/5 → 17/11/8

Fingerprint

Silicon
Transceivers
Networks (circuits)
Communication
Network-on-chip

Keywords

  • 3-D integration
  • Inductive-coupling link
  • Network-on-chips (NoC)

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Kadomoto, J., Amano, H., & Kuroda, T. (2018). An inductive-coupling link for 3-D Network-on-Chips. In Proceedings - International SoC Design Conference 2017, ISOCC 2017 (pp. 150-151). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2017.8368841

An inductive-coupling link for 3-D Network-on-Chips. / Kadomoto, Junichiro; Amano, Hideharu; Kuroda, Tadahiro.

Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. p. 150-151.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kadomoto, J, Amano, H & Kuroda, T 2018, An inductive-coupling link for 3-D Network-on-Chips. in Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., pp. 150-151, 14th International SoC Design Conference, ISOCC 2017, Seoul, Korea, Republic of, 17/11/5. https://doi.org/10.1109/ISOCC.2017.8368841
Kadomoto J, Amano H, Kuroda T. An inductive-coupling link for 3-D Network-on-Chips. In Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc. 2018. p. 150-151 https://doi.org/10.1109/ISOCC.2017.8368841
Kadomoto, Junichiro ; Amano, Hideharu ; Kuroda, Tadahiro. / An inductive-coupling link for 3-D Network-on-Chips. Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 150-151
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