An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM

Kiichi Niitsu, Yasuhisa Shimazaki, Yasufumi Sugimori, Yoshinori Kohama, Kazutaka Kasuga, Itaru Nonomura, Makoto Saen, Shigenobu Komatsu, Kenichi Osada, Naohiko Irie, Toshihiro Hattori, Atsushi Hasegawa, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

51 Citations (Scopus)
Original languageEnglish
Title of host publicationDigest of Technical Papers - IEEE International Solid-State Circuits Conference
DOIs
Publication statusPublished - 2009
Event2009 IEEE International Solid-State Circuits Conference ISSCC 2009 - San Francisco, CA, United States
Duration: 2009 Feb 82009 Feb 12

Other

Other2009 IEEE International Solid-State Circuits Conference ISSCC 2009
CountryUnited States
CitySan Francisco, CA
Period09/2/809/2/12

Fingerprint

Static random access storage

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Niitsu, K., Shimazaki, Y., Sugimori, Y., Kohama, Y., Kasuga, K., Nonomura, I., ... Kuroda, T. (2009). An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM. In Digest of Technical Papers - IEEE International Solid-State Circuits Conference [4977517] https://doi.org/10.1109/ISSCC.2009.4977517

An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM. / Niitsu, Kiichi; Shimazaki, Yasuhisa; Sugimori, Yasufumi; Kohama, Yoshinori; Kasuga, Kazutaka; Nonomura, Itaru; Saen, Makoto; Komatsu, Shigenobu; Osada, Kenichi; Irie, Naohiko; Hattori, Toshihiro; Hasegawa, Atsushi; Kuroda, Tadahiro.

Digest of Technical Papers - IEEE International Solid-State Circuits Conference. 2009. 4977517.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Niitsu, K, Shimazaki, Y, Sugimori, Y, Kohama, Y, Kasuga, K, Nonomura, I, Saen, M, Komatsu, S, Osada, K, Irie, N, Hattori, T, Hasegawa, A & Kuroda, T 2009, An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM. in Digest of Technical Papers - IEEE International Solid-State Circuits Conference., 4977517, 2009 IEEE International Solid-State Circuits Conference ISSCC 2009, San Francisco, CA, United States, 09/2/8. https://doi.org/10.1109/ISSCC.2009.4977517
Niitsu K, Shimazaki Y, Sugimori Y, Kohama Y, Kasuga K, Nonomura I et al. An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM. In Digest of Technical Papers - IEEE International Solid-State Circuits Conference. 2009. 4977517 https://doi.org/10.1109/ISSCC.2009.4977517
Niitsu, Kiichi ; Shimazaki, Yasuhisa ; Sugimori, Yasufumi ; Kohama, Yoshinori ; Kasuga, Kazutaka ; Nonomura, Itaru ; Saen, Makoto ; Komatsu, Shigenobu ; Osada, Kenichi ; Irie, Naohiko ; Hattori, Toshihiro ; Hasegawa, Atsushi ; Kuroda, Tadahiro. / An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM. Digest of Technical Papers - IEEE International Solid-State Circuits Conference. 2009.
@inproceedings{11ad8a25dd03486e84b7ce3ea9911e80,
title = "An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM",
author = "Kiichi Niitsu and Yasuhisa Shimazaki and Yasufumi Sugimori and Yoshinori Kohama and Kazutaka Kasuga and Itaru Nonomura and Makoto Saen and Shigenobu Komatsu and Kenichi Osada and Naohiko Irie and Toshihiro Hattori and Atsushi Hasegawa and Tadahiro Kuroda",
year = "2009",
doi = "10.1109/ISSCC.2009.4977517",
language = "English",
isbn = "1424434580",
booktitle = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",

}

TY - GEN

T1 - An inductive-coupling link for 3D integration of a 90nm CMOS processor and a 65nm CMOS SRAM

AU - Niitsu, Kiichi

AU - Shimazaki, Yasuhisa

AU - Sugimori, Yasufumi

AU - Kohama, Yoshinori

AU - Kasuga, Kazutaka

AU - Nonomura, Itaru

AU - Saen, Makoto

AU - Komatsu, Shigenobu

AU - Osada, Kenichi

AU - Irie, Naohiko

AU - Hattori, Toshihiro

AU - Hasegawa, Atsushi

AU - Kuroda, Tadahiro

PY - 2009

Y1 - 2009

UR - http://www.scopus.com/inward/record.url?scp=70349291205&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=70349291205&partnerID=8YFLogxK

U2 - 10.1109/ISSCC.2009.4977517

DO - 10.1109/ISSCC.2009.4977517

M3 - Conference contribution

AN - SCOPUS:70349291205

SN - 1424434580

SN - 9781424434589

BT - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

ER -