An MCM-D module using newly structured thermal management technique

Naoaki Yamanaka; A. Harada; K. Kaizu; T. Kawamura

doi:10.1109/IEMTIM.1998.704632

An MCM-D module using newly structured thermal management technique

Naoaki Yamanaka, A. Harada, K. Kaizu, T. Kawamura

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper describes a newly developed MCM-D microprocessor module for advanced ATM switching systems. The Si-substrate MCM-D technology, which integrates a Motorola 68030 microprocessor, interface control, and peripheral control custom VLSIs, high-speed SRAMs and FPGAs (field programmable gate arrays), is employed. This is made possible by high density packaging with the stacked high-speed RAM technique, and reduces module size by 7/8 compared to conventional surface mounting schemes. In addition, a uniquely structured thermal management technique is employed. MCM heat flows to the printed motherboard power supply layer through via holes. Using this technique, module volume can be dramatically reduced. This microprocessor module technology and MCM technology has been developed to advance the development of practical B-ISDN ATM switching systems.

Original language	English
Title of host publication	2nd 1998 IEMT/IMC Symposium
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	255-260
Number of pages	6
Volume	1998-April
ISBN (Electronic)	0780350901, 9780780350908
DOIs	https://doi.org/10.1109/IEMTIM.1998.704632
Publication status	Published - 1998 Jan 1
Externally published	Yes
Event	2nd International Electronic Manufacturing Technology and International Microelectronics Conference Symposium, IEMT/IMC 1998 - Tokyo, Japan Duration: 1998 Apr 15 → 1998 Apr 17

Other

Other	2nd International Electronic Manufacturing Technology and International Microelectronics Conference Symposium, IEMT/IMC 1998
Country/Territory	Japan
City	Tokyo
Period	98/4/15 → 98/4/17

ASJC Scopus subject areas

Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials

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10.1109/IEMTIM.1998.704632

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Yamanaka, N, Harada, A, Kaizu, K & Kawamura, T 1998, An MCM-D module using newly structured thermal management technique. in 2nd 1998 IEMT/IMC Symposium. vol. 1998-April, Institute of Electrical and Electronics Engineers Inc., pp. 255-260, 2nd International Electronic Manufacturing Technology and International Microelectronics Conference Symposium, IEMT/IMC 1998, Tokyo, Japan, 98/4/15. https://doi.org/10.1109/IEMTIM.1998.704632

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abstract = "This paper describes a newly developed MCM-D microprocessor module for advanced ATM switching systems. The Si-substrate MCM-D technology, which integrates a Motorola 68030 microprocessor, interface control, and peripheral control custom VLSIs, high-speed SRAMs and FPGAs (field programmable gate arrays), is employed. This is made possible by high density packaging with the stacked high-speed RAM technique, and reduces module size by 7/8 compared to conventional surface mounting schemes. In addition, a uniquely structured thermal management technique is employed. MCM heat flows to the printed motherboard power supply layer through via holes. Using this technique, module volume can be dramatically reduced. This microprocessor module technology and MCM technology has been developed to advance the development of practical B-ISDN ATM switching systems.",

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N2 - This paper describes a newly developed MCM-D microprocessor module for advanced ATM switching systems. The Si-substrate MCM-D technology, which integrates a Motorola 68030 microprocessor, interface control, and peripheral control custom VLSIs, high-speed SRAMs and FPGAs (field programmable gate arrays), is employed. This is made possible by high density packaging with the stacked high-speed RAM technique, and reduces module size by 7/8 compared to conventional surface mounting schemes. In addition, a uniquely structured thermal management technique is employed. MCM heat flows to the printed motherboard power supply layer through via holes. Using this technique, module volume can be dramatically reduced. This microprocessor module technology and MCM technology has been developed to advance the development of practical B-ISDN ATM switching systems.

AB - This paper describes a newly developed MCM-D microprocessor module for advanced ATM switching systems. The Si-substrate MCM-D technology, which integrates a Motorola 68030 microprocessor, interface control, and peripheral control custom VLSIs, high-speed SRAMs and FPGAs (field programmable gate arrays), is employed. This is made possible by high density packaging with the stacked high-speed RAM technique, and reduces module size by 7/8 compared to conventional surface mounting schemes. In addition, a uniquely structured thermal management technique is employed. MCM heat flows to the printed motherboard power supply layer through via holes. Using this technique, module volume can be dramatically reduced. This microprocessor module technology and MCM technology has been developed to advance the development of practical B-ISDN ATM switching systems.

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ER -

An MCM-D module using newly structured thermal management technique

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