Abstract
This paper describes a newly developed MCM-D microprocessor module for advanced ATM switching systems. The Si-substrate MCM-D technology, which integrates a Motorola 68030 microprocessor, interface control, and peripheral control custom VLSIs, high-speed SRAMs and FPGAs (field programmable gate arrays), is employed. This is made possible by high density packaging with the stacked high-speed RAM technique, and reduces module size by 7/8 compared to conventional surface mounting schemes. In addition, a uniquely structured thermal management technique is employed. MCM heat flows to the printed motherboard power supply layer through via holes. Using this technique, module volume can be dramatically reduced. This microprocessor module technology and MCM technology has been developed to advance the development of practical B-ISDN ATM switching systems.
| Original language | English |
|---|---|
| Title of host publication | 2nd 1998 IEMT/IMC Symposium |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 255-260 |
| Number of pages | 6 |
| Volume | 1998-April |
| ISBN (Electronic) | 0780350901, 9780780350908 |
| DOIs | |
| Publication status | Published - 1998 Jan 1 |
| Externally published | Yes |
| Event | 2nd International Electronic Manufacturing Technology and International Microelectronics Conference Symposium, IEMT/IMC 1998 - Tokyo, Japan Duration: 1998 Apr 15 → 1998 Apr 17 |
Other
| Other | 2nd International Electronic Manufacturing Technology and International Microelectronics Conference Symposium, IEMT/IMC 1998 |
|---|---|
| Country | Japan |
| City | Tokyo |
| Period | 98/4/15 → 98/4/17 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Industrial and Manufacturing Engineering
- Electronic, Optical and Magnetic Materials
Cite this
An MCM-D module using newly structured thermal management technique. / Yamanaka, Naoaki; Harada, A.; Kaizu, K.; Kawamura, T.
2nd 1998 IEMT/IMC Symposium. Vol. 1998-April Institute of Electrical and Electronics Engineers Inc., 1998. p. 255-260.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - An MCM-D module using newly structured thermal management technique
AU - Yamanaka, Naoaki
AU - Harada, A.
AU - Kaizu, K.
AU - Kawamura, T.
PY - 1998/1/1
Y1 - 1998/1/1
N2 - This paper describes a newly developed MCM-D microprocessor module for advanced ATM switching systems. The Si-substrate MCM-D technology, which integrates a Motorola 68030 microprocessor, interface control, and peripheral control custom VLSIs, high-speed SRAMs and FPGAs (field programmable gate arrays), is employed. This is made possible by high density packaging with the stacked high-speed RAM technique, and reduces module size by 7/8 compared to conventional surface mounting schemes. In addition, a uniquely structured thermal management technique is employed. MCM heat flows to the printed motherboard power supply layer through via holes. Using this technique, module volume can be dramatically reduced. This microprocessor module technology and MCM technology has been developed to advance the development of practical B-ISDN ATM switching systems.
AB - This paper describes a newly developed MCM-D microprocessor module for advanced ATM switching systems. The Si-substrate MCM-D technology, which integrates a Motorola 68030 microprocessor, interface control, and peripheral control custom VLSIs, high-speed SRAMs and FPGAs (field programmable gate arrays), is employed. This is made possible by high density packaging with the stacked high-speed RAM technique, and reduces module size by 7/8 compared to conventional surface mounting schemes. In addition, a uniquely structured thermal management technique is employed. MCM heat flows to the printed motherboard power supply layer through via holes. Using this technique, module volume can be dramatically reduced. This microprocessor module technology and MCM technology has been developed to advance the development of practical B-ISDN ATM switching systems.
UR - http://www.scopus.com/inward/record.url?scp=85049753566&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85049753566&partnerID=8YFLogxK
U2 - 10.1109/IEMTIM.1998.704632
DO - 10.1109/IEMTIM.1998.704632
M3 - Conference contribution
VL - 1998-April
SP - 255
EP - 260
BT - 2nd 1998 IEMT/IMC Symposium
PB - Institute of Electrical and Electronics Engineers Inc.
ER -