An MCM-D module using newly structured thermal management technique

Naoaki Yamanaka, A. Harada, K. Kaizu, T. Kawamura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper describes a newly developed MCM-D microprocessor module for advanced ATM switching systems. The Si-substrate MCM-D technology, which integrates a Motorola 68030 microprocessor, interface control, and peripheral control custom VLSIs, high-speed SRAMs and FPGAs (field programmable gate arrays), is employed. This is made possible by high density packaging with the stacked high-speed RAM technique, and reduces module size by 7/8 compared to conventional surface mounting schemes. In addition, a uniquely structured thermal management technique is employed. MCM heat flows to the printed motherboard power supply layer through via holes. Using this technique, module volume can be dramatically reduced. This microprocessor module technology and MCM technology has been developed to advance the development of practical B-ISDN ATM switching systems.

Original languageEnglish
Title of host publication2nd 1998 IEMT/IMC Symposium
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages255-260
Number of pages6
Volume1998-April
ISBN (Electronic)0780350901, 9780780350908
DOIs
Publication statusPublished - 1998 Jan 1
Externally publishedYes
Event2nd International Electronic Manufacturing Technology and International Microelectronics Conference Symposium, IEMT/IMC 1998 - Tokyo, Japan
Duration: 1998 Apr 151998 Apr 17

Other

Other2nd International Electronic Manufacturing Technology and International Microelectronics Conference Symposium, IEMT/IMC 1998
CountryJapan
CityTokyo
Period98/4/1598/4/17

Fingerprint

Multicarrier modulation
Temperature control
Microprocessor chips
Switching systems
Automatic teller machines
Voice/data communication systems
Static random access storage
Random access storage
Mountings
Field programmable gate arrays (FPGA)
Packaging
Heat transfer
Substrates

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Yamanaka, N., Harada, A., Kaizu, K., & Kawamura, T. (1998). An MCM-D module using newly structured thermal management technique. In 2nd 1998 IEMT/IMC Symposium (Vol. 1998-April, pp. 255-260). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEMTIM.1998.704632

An MCM-D module using newly structured thermal management technique. / Yamanaka, Naoaki; Harada, A.; Kaizu, K.; Kawamura, T.

2nd 1998 IEMT/IMC Symposium. Vol. 1998-April Institute of Electrical and Electronics Engineers Inc., 1998. p. 255-260.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yamanaka, N, Harada, A, Kaizu, K & Kawamura, T 1998, An MCM-D module using newly structured thermal management technique. in 2nd 1998 IEMT/IMC Symposium. vol. 1998-April, Institute of Electrical and Electronics Engineers Inc., pp. 255-260, 2nd International Electronic Manufacturing Technology and International Microelectronics Conference Symposium, IEMT/IMC 1998, Tokyo, Japan, 98/4/15. https://doi.org/10.1109/IEMTIM.1998.704632
Yamanaka N, Harada A, Kaizu K, Kawamura T. An MCM-D module using newly structured thermal management technique. In 2nd 1998 IEMT/IMC Symposium. Vol. 1998-April. Institute of Electrical and Electronics Engineers Inc. 1998. p. 255-260 https://doi.org/10.1109/IEMTIM.1998.704632
Yamanaka, Naoaki ; Harada, A. ; Kaizu, K. ; Kawamura, T. / An MCM-D module using newly structured thermal management technique. 2nd 1998 IEMT/IMC Symposium. Vol. 1998-April Institute of Electrical and Electronics Engineers Inc., 1998. pp. 255-260
@inproceedings{c5899c8fd8204de18bf5f6b28475d872,
title = "An MCM-D module using newly structured thermal management technique",
abstract = "This paper describes a newly developed MCM-D microprocessor module for advanced ATM switching systems. The Si-substrate MCM-D technology, which integrates a Motorola 68030 microprocessor, interface control, and peripheral control custom VLSIs, high-speed SRAMs and FPGAs (field programmable gate arrays), is employed. This is made possible by high density packaging with the stacked high-speed RAM technique, and reduces module size by 7/8 compared to conventional surface mounting schemes. In addition, a uniquely structured thermal management technique is employed. MCM heat flows to the printed motherboard power supply layer through via holes. Using this technique, module volume can be dramatically reduced. This microprocessor module technology and MCM technology has been developed to advance the development of practical B-ISDN ATM switching systems.",
author = "Naoaki Yamanaka and A. Harada and K. Kaizu and T. Kawamura",
year = "1998",
month = "1",
day = "1",
doi = "10.1109/IEMTIM.1998.704632",
language = "English",
volume = "1998-April",
pages = "255--260",
booktitle = "2nd 1998 IEMT/IMC Symposium",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - An MCM-D module using newly structured thermal management technique

AU - Yamanaka, Naoaki

AU - Harada, A.

AU - Kaizu, K.

AU - Kawamura, T.

PY - 1998/1/1

Y1 - 1998/1/1

N2 - This paper describes a newly developed MCM-D microprocessor module for advanced ATM switching systems. The Si-substrate MCM-D technology, which integrates a Motorola 68030 microprocessor, interface control, and peripheral control custom VLSIs, high-speed SRAMs and FPGAs (field programmable gate arrays), is employed. This is made possible by high density packaging with the stacked high-speed RAM technique, and reduces module size by 7/8 compared to conventional surface mounting schemes. In addition, a uniquely structured thermal management technique is employed. MCM heat flows to the printed motherboard power supply layer through via holes. Using this technique, module volume can be dramatically reduced. This microprocessor module technology and MCM technology has been developed to advance the development of practical B-ISDN ATM switching systems.

AB - This paper describes a newly developed MCM-D microprocessor module for advanced ATM switching systems. The Si-substrate MCM-D technology, which integrates a Motorola 68030 microprocessor, interface control, and peripheral control custom VLSIs, high-speed SRAMs and FPGAs (field programmable gate arrays), is employed. This is made possible by high density packaging with the stacked high-speed RAM technique, and reduces module size by 7/8 compared to conventional surface mounting schemes. In addition, a uniquely structured thermal management technique is employed. MCM heat flows to the printed motherboard power supply layer through via holes. Using this technique, module volume can be dramatically reduced. This microprocessor module technology and MCM technology has been developed to advance the development of practical B-ISDN ATM switching systems.

UR - http://www.scopus.com/inward/record.url?scp=85049753566&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85049753566&partnerID=8YFLogxK

U2 - 10.1109/IEMTIM.1998.704632

DO - 10.1109/IEMTIM.1998.704632

M3 - Conference contribution

VL - 1998-April

SP - 255

EP - 260

BT - 2nd 1998 IEMT/IMC Symposium

PB - Institute of Electrical and Electronics Engineers Inc.

ER -