Analytical thruchip inductive coupling channel design optimization

Li Chung Hsu, Junichiro Kadomoto, So Hasegawa, Atsutake Kosuge, Yasuhiro Take, Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    3 Citations (Scopus)

    Abstract

    ThruChip interface (TCI) is an emerging 3-D integrated circuit stacking technology. TCI utilizes on-chip inductor to build vertical communication channel in near field distance and has been proved to stand comparison with through-siliconvia (TSV) in data rate, power, and reliability. Moreover, it is also cost-effective in manufacturing due to its wireless nature. In this paper, an analytical method is proposed to find near-optimal TCI inductive coupling channel solution. The experiment results show an average 16.8% transmitting current reduction and shrink design time from days to a few minutes.

    Original languageEnglish
    Title of host publication2016 21st Asia and South Pacific Design Automation Conference, ASP-DAC 2016
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages731-736
    Number of pages6
    Volume25-28-January-2016
    ISBN (Electronic)9781467395694
    DOIs
    Publication statusPublished - 2016 Mar 7
    Event21st Asia and South Pacific Design Automation Conference, ASP-DAC 2016 - Macao, Macao
    Duration: 2016 Jan 252016 Jan 28

    Other

    Other21st Asia and South Pacific Design Automation Conference, ASP-DAC 2016
    CountryMacao
    CityMacao
    Period16/1/2516/1/28

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    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Computer Science Applications
    • Computer Graphics and Computer-Aided Design

    Cite this

    Hsu, L. C., Kadomoto, J., Hasegawa, S., Kosuge, A., Take, Y., & Kuroda, T. (2016). Analytical thruchip inductive coupling channel design optimization. In 2016 21st Asia and South Pacific Design Automation Conference, ASP-DAC 2016 (Vol. 25-28-January-2016, pp. 731-736). [7428098] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASPDAC.2016.7428098