Anodic bonding for integrated capacitive sensors

M. Esashi, N. Ura, Y. Matsumoto

Research output: Chapter in Book/Report/Conference proceedingConference contribution

38 Citations (Scopus)

Abstract

Anodic bonding of silicon to Pyrex glass was studied from the viewpoint of its application to integrated capacitive sensors. Equipment that was developed to allow substrate bonding in atmosphere and in vacuum is described. Vertical and lateral electrical feedthrough structures, which have excellent electrical properties and airtight performance, were developed. The vertical feedthrough structures were applied to capacitive sensors. Other bonding-related problems that were studied, such as wafer distortion, circuit damage, and metalization, are noted.

Original languageEnglish
Title of host publicationProc IEEE Micro Electro Mech Syst Workshop
PublisherPubl by IEEE
Pages43-48
Number of pages6
ISBN (Print)0780304977, 9780780304970
DOIs
Publication statusPublished - 1992
EventProceedings of the IEEE Micro Electro Mechanical Systems Workshop - Travemuende, Ger
Duration: 1992 Feb 41992 Feb 7

Publication series

NameProc IEEE Micro Electro Mech Syst Workshop

Other

OtherProceedings of the IEEE Micro Electro Mechanical Systems Workshop
CityTravemuende, Ger
Period92/2/492/2/7

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Esashi, M., Ura, N., & Matsumoto, Y. (1992). Anodic bonding for integrated capacitive sensors. In Proc IEEE Micro Electro Mech Syst Workshop (pp. 43-48). (Proc IEEE Micro Electro Mech Syst Workshop). Publ by IEEE. https://doi.org/10.1109/memsys.1992.187688