Assembly of single adherent cells on mobile microplates

Hiroaki Onoe, Shoji Takeuchi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper describes single-cell-mounted mobile microplates. Microfabricated SiO2 microplates (20-75 μm in diameter and 2 μm in thickness) carry single adherent cells. The microplates are released freely from a plate-holding PDMS substrate. These microplates enabled us to handle adherent cells as if they were floating cells. We applied this cell-handling technique to two types of assembly: (i) microplate-guided 2D assembly of heterogeneous cells for cell-cell interaction analysis, and (ii) 3D microplate assembly powered by cell traction force for fabricating 3D microstructures. These assembly experiments indicate that the cell-mounted mobile microplates make it possible to handle single adherent cells and have potentials to assemble cell-plate microstructures.

Original languageEnglish
Title of host publicationMEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems
Pages300-303
Number of pages4
DOIs
Publication statusPublished - 2008 Aug 29
Externally publishedYes
Event21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson - Tucson, AZ, United States
Duration: 2008 Jan 132008 Jan 17

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson
CountryUnited States
CityTucson, AZ
Period08/1/1308/1/17

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Onoe, H., & Takeuchi, S. (2008). Assembly of single adherent cells on mobile microplates. In MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems (pp. 300-303). [4443652] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2008.4443652