Break even time analysis using empirical overhead parameters for embedded systems on SOTB technology

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

It is essential for any embedded systems and increasing popularity of Internet of Things (IoT) be energy efficient. Such systems tend to work intermittently and reducing leakage in the idle time is essential. Energy reduction techniques bring the system to a low power mode which also provokes transition overheads. If such overheads are not considered, the task may not be schedulable under a given deadline. To get a gain in energy savings, the idle state must be longer than a minimum required time. This time is referred as Break Even Time (BET). To properly design efficient algorithms and schedulers we must calculate and include the BET. In this paper, we present the first studies to examine the BET using accurate parameters extracted from a real chip using Silicon On Thin Box (SOTB) technology employing Body Bias Control (BB) energy saving technique. In this study, we demonstrate the BET range for SOTB microcontrollers, on the order of 0.5ms up to 1ms.

Original languageEnglish
Title of host publication2017 32nd Conference on Design of Circuits and Integrated Systems, DCIS 2017 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-6
Number of pages6
Volume2017-November
ISBN (Electronic)9781538651087
DOIs
Publication statusPublished - 2018 Mar 9
Event32nd Conference on Design of Circuits and Integrated Systems, DCIS 2017 - Barcelona, Spain
Duration: 2017 Nov 222017 Nov 24

Other

Other32nd Conference on Design of Circuits and Integrated Systems, DCIS 2017
CountrySpain
CityBarcelona
Period17/11/2217/11/24

Fingerprint

Embedded systems
Energy conservation
Silicon
Microcontrollers
Internet of things

Keywords

  • BET
  • Body Bias
  • Break Even Time
  • Energy-Overhead
  • Low power\Time-Overhead
  • Silicon-on-insulator
  • SOTB
  • Switching
  • Transition

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

Cite this

Cortes, C., Amano, H., & Yamasaki, N. (2018). Break even time analysis using empirical overhead parameters for embedded systems on SOTB technology. In 2017 32nd Conference on Design of Circuits and Integrated Systems, DCIS 2017 - Proceedings (Vol. 2017-November, pp. 1-6). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DCIS.2017.8311633

Break even time analysis using empirical overhead parameters for embedded systems on SOTB technology. / Cortes, Carlos; Amano, Hideharu; Yamasaki, Nobuyuki.

2017 32nd Conference on Design of Circuits and Integrated Systems, DCIS 2017 - Proceedings. Vol. 2017-November Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-6.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cortes, C, Amano, H & Yamasaki, N 2018, Break even time analysis using empirical overhead parameters for embedded systems on SOTB technology. in 2017 32nd Conference on Design of Circuits and Integrated Systems, DCIS 2017 - Proceedings. vol. 2017-November, Institute of Electrical and Electronics Engineers Inc., pp. 1-6, 32nd Conference on Design of Circuits and Integrated Systems, DCIS 2017, Barcelona, Spain, 17/11/22. https://doi.org/10.1109/DCIS.2017.8311633
Cortes C, Amano H, Yamasaki N. Break even time analysis using empirical overhead parameters for embedded systems on SOTB technology. In 2017 32nd Conference on Design of Circuits and Integrated Systems, DCIS 2017 - Proceedings. Vol. 2017-November. Institute of Electrical and Electronics Engineers Inc. 2018. p. 1-6 https://doi.org/10.1109/DCIS.2017.8311633
Cortes, Carlos ; Amano, Hideharu ; Yamasaki, Nobuyuki. / Break even time analysis using empirical overhead parameters for embedded systems on SOTB technology. 2017 32nd Conference on Design of Circuits and Integrated Systems, DCIS 2017 - Proceedings. Vol. 2017-November Institute of Electrical and Electronics Engineers Inc., 2018. pp. 1-6
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