Building block multi-chip systems using inductive coupling through chip interface

Hideharu Amano; Tadahiro Kuroda; Hiroshi Nakamura; Kimiyoshi Usami; Masaaki Kondo; Hiroki Matsutani; Mitaro Namiki

doi:10.1109/ISOCC.2017.8368842

Building block multi-chip systems using inductive coupling through chip interface

Hideharu Amano, Tadahiro Kuroda, Hiroshi Nakamura, Kimiyoshi Usami, Masaaki Kondo, Hiroki Matsutani, Mitaro Namiki

Department of Information and Computer Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A building block computing system is consisting of multiple chips connecting with inductive coupling wireless through chip interconnect. Like building Lego blocks, various types of systems can be built by stacking different types of chips. In order to develop such systems, several techniques are investigated in the project: that is, inductive coupling wireless through chip interface, low power circuit technologies, autonomous interconnection network architectures, thermal dissipation and building block operating system. Here, the overview of the project and a prototype system are introduced.

Original language	English
Title of host publication	Proceedings - International SoC Design Conference 2017, ISOCC 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	152-154
Number of pages	3
ISBN (Electronic)	9781538622858
DOIs	https://doi.org/10.1109/ISOCC.2017.8368842
Publication status	Published - 2018 May 29
Event	14th International SoC Design Conference, ISOCC 2017 - Seoul, Korea, Republic of Duration: 2017 Nov 5 → 2017 Nov 8

Publication series

Name	Proceedings - International SoC Design Conference 2017, ISOCC 2017

Other

Other	14th International SoC Design Conference, ISOCC 2017
Country/Territory	Korea, Republic of
City	Seoul
Period	17/11/5 → 17/11/8

Keywords

Building block computing systems
System-in-a Package
Wireless inductive coupling

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/ISOCC.2017.8368842

Cite this

Amano, H., Kuroda, T., Nakamura, H., Usami, K., Kondo, M., Matsutani, H., & Namiki, M. (2018). Building block multi-chip systems using inductive coupling through chip interface. In Proceedings - International SoC Design Conference 2017, ISOCC 2017 (pp. 152-154). (Proceedings - International SoC Design Conference 2017, ISOCC 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2017.8368842

Building block multi-chip systems using inductive coupling through chip interface. / Amano, Hideharu; Kuroda, Tadahiro; Nakamura, Hiroshi et al.
Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. p. 152-154 (Proceedings - International SoC Design Conference 2017, ISOCC 2017).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Amano, H, Kuroda, T, Nakamura, H, Usami, K, Kondo, M , Matsutani, H & Namiki, M 2018, Building block multi-chip systems using inductive coupling through chip interface. in Proceedings - International SoC Design Conference 2017, ISOCC 2017. Proceedings - International SoC Design Conference 2017, ISOCC 2017, Institute of Electrical and Electronics Engineers Inc., pp. 152-154, 14th International SoC Design Conference, ISOCC 2017, Seoul, Korea, Republic of, 17/11/5. https://doi.org/10.1109/ISOCC.2017.8368842

Amano H, Kuroda T, Nakamura H, Usami K, Kondo M , Matsutani H et al. Building block multi-chip systems using inductive coupling through chip interface. In Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc. 2018. p. 152-154. (Proceedings - International SoC Design Conference 2017, ISOCC 2017). doi: 10.1109/ISOCC.2017.8368842

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Building block multi-chip systems using inductive coupling through chip interface

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Keywords

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