Building block operating system for 3D stacked computer systems with inductive coupling interconnect

Shinsuke Hamada, Atsushi Koshiba, Mitaro Namiki, Hideharu Amano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper describes the software system for the building block computing systems. The programs on the system are executed by the building block OS that manages configuration information of the 3D stacked chips and virtualizes the accelerators as the OpenCL functions. In addition, the OS controls the power supply of the chips implemented with SOTB (Silicon on Thin Box). This paper introduces the basic concepts and functions of the software systems for the building block computing systems.

Original languageEnglish
Title of host publicationProceedings - International SoC Design Conference 2017, ISOCC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages157-158
Number of pages2
ISBN (Electronic)9781538622858
DOIs
Publication statusPublished - 2018 May 29
Event14th International SoC Design Conference, ISOCC 2017 - Seoul, Korea, Republic of
Duration: 2017 Nov 52017 Nov 8

Other

Other14th International SoC Design Conference, ISOCC 2017
CountryKorea, Republic of
CitySeoul
Period17/11/517/11/8

Fingerprint

Computer operating systems
Computer systems
Silicon
Particle accelerators

Keywords

  • OpenCL
  • Operating System
  • SOTB
  • TCI

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Hamada, S., Koshiba, A., Namiki, M., & Amano, H. (2018). Building block operating system for 3D stacked computer systems with inductive coupling interconnect. In Proceedings - International SoC Design Conference 2017, ISOCC 2017 (pp. 157-158). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ISOCC.2017.8368844

Building block operating system for 3D stacked computer systems with inductive coupling interconnect. / Hamada, Shinsuke; Koshiba, Atsushi; Namiki, Mitaro; Amano, Hideharu.

Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. p. 157-158.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hamada, S, Koshiba, A, Namiki, M & Amano, H 2018, Building block operating system for 3D stacked computer systems with inductive coupling interconnect. in Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., pp. 157-158, 14th International SoC Design Conference, ISOCC 2017, Seoul, Korea, Republic of, 17/11/5. https://doi.org/10.1109/ISOCC.2017.8368844
Hamada S, Koshiba A, Namiki M, Amano H. Building block operating system for 3D stacked computer systems with inductive coupling interconnect. In Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc. 2018. p. 157-158 https://doi.org/10.1109/ISOCC.2017.8368844
Hamada, Shinsuke ; Koshiba, Atsushi ; Namiki, Mitaro ; Amano, Hideharu. / Building block operating system for 3D stacked computer systems with inductive coupling interconnect. Proceedings - International SoC Design Conference 2017, ISOCC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 157-158
@inproceedings{5496882b0c95490fa8550b4d1e1ed106,
title = "Building block operating system for 3D stacked computer systems with inductive coupling interconnect",
abstract = "This paper describes the software system for the building block computing systems. The programs on the system are executed by the building block OS that manages configuration information of the 3D stacked chips and virtualizes the accelerators as the OpenCL functions. In addition, the OS controls the power supply of the chips implemented with SOTB (Silicon on Thin Box). This paper introduces the basic concepts and functions of the software systems for the building block computing systems.",
keywords = "OpenCL, Operating System, SOTB, TCI",
author = "Shinsuke Hamada and Atsushi Koshiba and Mitaro Namiki and Hideharu Amano",
year = "2018",
month = "5",
day = "29",
doi = "10.1109/ISOCC.2017.8368844",
language = "English",
pages = "157--158",
booktitle = "Proceedings - International SoC Design Conference 2017, ISOCC 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - Building block operating system for 3D stacked computer systems with inductive coupling interconnect

AU - Hamada, Shinsuke

AU - Koshiba, Atsushi

AU - Namiki, Mitaro

AU - Amano, Hideharu

PY - 2018/5/29

Y1 - 2018/5/29

N2 - This paper describes the software system for the building block computing systems. The programs on the system are executed by the building block OS that manages configuration information of the 3D stacked chips and virtualizes the accelerators as the OpenCL functions. In addition, the OS controls the power supply of the chips implemented with SOTB (Silicon on Thin Box). This paper introduces the basic concepts and functions of the software systems for the building block computing systems.

AB - This paper describes the software system for the building block computing systems. The programs on the system are executed by the building block OS that manages configuration information of the 3D stacked chips and virtualizes the accelerators as the OpenCL functions. In addition, the OS controls the power supply of the chips implemented with SOTB (Silicon on Thin Box). This paper introduces the basic concepts and functions of the software systems for the building block computing systems.

KW - OpenCL

KW - Operating System

KW - SOTB

KW - TCI

UR - http://www.scopus.com/inward/record.url?scp=85048855877&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85048855877&partnerID=8YFLogxK

U2 - 10.1109/ISOCC.2017.8368844

DO - 10.1109/ISOCC.2017.8368844

M3 - Conference contribution

SP - 157

EP - 158

BT - Proceedings - International SoC Design Conference 2017, ISOCC 2017

PB - Institute of Electrical and Electronics Engineers Inc.

ER -