Carbon nanotube technologies for LSI via iterconnects

Yuji Awano

doi:10.1093/ietele/e89-c.11.1499

Carbon nanotube technologies for LSI via iterconnects

Yuji Awano

Research output: Contribution to journal › Article › peer-review

32 Citations (Scopus)

Abstract

Carbon nanotubes (CNTs) offer unique properties such as highest current density exceeding 10⁹ A/cm², ultra-high thermal conductivity as high as that of diamond, ballistic transport along the tube and extremely high mechanical strength with high aspect ratio of more than 1000. Because of these remarkable properties, they have been expected for use as future wiring materials to solve several problems, for examples, stress and electro-migration, heat removal and fabrication of a small-sized via in future LSIs. In this paper, we demonstrate present status of CNT material technologies and the potential of metallic CNT vias. In particular, we report our original catalytic nano-particle technique for controlling the diameter and density of CNTs. We have succeeded in forming a 40-nm via with the CNT density of 9 × 10¹¹/cm², which is the highest density ever reported. The low temperature CVD growth and the electrical properties of CNT vias are also discussed.

Original language	English
Pages (from-to)	1499-1503
Number of pages	5
Journal	IEICE Transactions on Electronics
Volume	E89-C
Issue number	11
DOIs	https://doi.org/10.1093/ietele/e89-c.11.1499
Publication status	Published - 2006 Nov
Externally published	Yes

Keywords

CVD
Carbon nanotube
Interconnect
Nanotechnology

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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