Carbon nanotube via interconnect technologies: Size-classified catalyst nanoparticles and low-resistance ohmic contact formation

Y. Awano, S. Sato, D. Kondo, M. Ohfuti, A. Kawabata, M. Nihei, N. Yokoyama

Research output: Contribution to journalArticle

75 Citations (Scopus)

Abstract

We propose a new approach to fabricating carbon nanotube (CNT) via interconnects for future LSIs, which uses preformed catalyst nanoparticles to grow the CNTs. A newly designed impactor provided size-classified catalyst particles. For the new approach, we employ a TiN contact layer which is more resistant to oxidation and enables us to form a lower resistance ohmic contact between CNTs and wiring layers. The resultant CNT-via resistance was 0.59 Ω for 2-μm vias, which is the smallest ever reported. We also study the CNT nucleation process using molecular dynamics and discuss how to remove amorphous carbon from the nucleation process.

Original languageEnglish
Pages (from-to)3611-3616
Number of pages6
JournalPhysica Status Solidi (A) Applications and Materials Science
Volume203
Issue number14
DOIs
Publication statusPublished - 2006 Nov 1
Externally publishedYes

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering
  • Materials Chemistry

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