Carbon nanotube via interconnect technologies: Size-classified catalyst nanoparticles and low-resistance ohmic contact formation

Yuji Awano, S. Sato, D. Kondo, M. Ohfuti, A. Kawabata, M. Nihei, N. Yokoyama

Research output: Contribution to journalArticle

75 Citations (Scopus)

Abstract

We propose a new approach to fabricating carbon nanotube (CNT) via interconnects for future LSIs, which uses preformed catalyst nanoparticles to grow the CNTs. A newly designed impactor provided size-classified catalyst particles. For the new approach, we employ a TiN contact layer which is more resistant to oxidation and enables us to form a lower resistance ohmic contact between CNTs and wiring layers. The resultant CNT-via resistance was 0.59 Ω for 2-μm vias, which is the smallest ever reported. We also study the CNT nucleation process using molecular dynamics and discuss how to remove amorphous carbon from the nucleation process.

Original languageEnglish
Pages (from-to)3611-3616
Number of pages6
JournalPhysica Status Solidi (A) Applications and Materials Science
Volume203
Issue number14
DOIs
Publication statusPublished - 2006 Nov
Externally publishedYes

Fingerprint

Carbon Nanotubes
Ohmic contacts
low resistance
electric contacts
Carbon nanotubes
carbon nanotubes
Nanoparticles
catalysts
nanoparticles
Catalysts
Nucleation
Amorphous carbon
Electric wiring
Molecular dynamics
nucleation
impactors
large scale integration
wiring
Oxidation
molecular dynamics

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

Cite this

Carbon nanotube via interconnect technologies : Size-classified catalyst nanoparticles and low-resistance ohmic contact formation. / Awano, Yuji; Sato, S.; Kondo, D.; Ohfuti, M.; Kawabata, A.; Nihei, M.; Yokoyama, N.

In: Physica Status Solidi (A) Applications and Materials Science, Vol. 203, No. 14, 11.2006, p. 3611-3616.

Research output: Contribution to journalArticle

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