Carbon nanotube via interconnect technologies: Size-classified catalyst nanoparticles and low-resistance ohmic contact formation

Y. Awano; S. Sato; D. Kondo; M. Ohfuti; A. Kawabata; M. Nihei; N. Yokoyama

doi:10.1002/pssa.200622415

Carbon nanotube via interconnect technologies: Size-classified catalyst nanoparticles and low-resistance ohmic contact formation

Y. Awano, S. Sato, D. Kondo, M. Ohfuti, A. Kawabata, M. Nihei, N. Yokoyama

Research output: Contribution to journal › Article › peer-review

75 Citations (Scopus)

Abstract

We propose a new approach to fabricating carbon nanotube (CNT) via interconnects for future LSIs, which uses preformed catalyst nanoparticles to grow the CNTs. A newly designed impactor provided size-classified catalyst particles. For the new approach, we employ a TiN contact layer which is more resistant to oxidation and enables us to form a lower resistance ohmic contact between CNTs and wiring layers. The resultant CNT-via resistance was 0.59 Ω for 2-μm vias, which is the smallest ever reported. We also study the CNT nucleation process using molecular dynamics and discuss how to remove amorphous carbon from the nucleation process.

Original language	English
Pages (from-to)	3611-3616
Number of pages	6
Journal	Physica Status Solidi (A) Applications and Materials Science
Volume	203
Issue number	14
DOIs	https://doi.org/10.1002/pssa.200622415
Publication status	Published - 2006 Nov

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Surfaces and Interfaces
Surfaces, Coatings and Films
Electrical and Electronic Engineering
Materials Chemistry

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10.1002/pssa.200622415

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Carbon nanotube via interconnect technologies : Size-classified catalyst nanoparticles and low-resistance ohmic contact formation. / Awano, Y.; Sato, S.; Kondo, D.; Ohfuti, M.; Kawabata, A.; Nihei, M.; Yokoyama, N.

In: Physica Status Solidi (A) Applications and Materials Science, Vol. 203, No. 14, 11.2006, p. 3611-3616.

Research output: Contribution to journal › Article › peer-review

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