Carbon nanotube vias for future LSI interconnects

Mizuhisa Nihei, Masahiro Horibe, Akio Kawabata, Yuji Awano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

65 Citations (Scopus)

Abstract

We have developed carbon nanotube (CNT) vias consisting of about 1000 tubes. The total resistance of the CNT via was measured as three orders of magnitude lower than that of one CNT, indicating that the current flows hi parallel through about 1000 tubes. There is no degradation observed for 100 hours at the via current density of 2×106 A/cm2, which is favorably compared with Cu vias. This is the first trial demonstration of CNT vias for future LSI interconnects.

Original languageEnglish
Title of host publicationProceedings of the IEEE 2004 International Interconnect Technology Conference
Pages251-253
Number of pages3
Publication statusPublished - 2004
Externally publishedYes
EventProceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, United States
Duration: 2004 Jun 72004 Jun 9

Other

OtherProceedings of the IEEE 2004 International Interconnect Technology Conference
CountryUnited States
CityBurlingame, CA
Period04/6/704/6/9

Fingerprint

Carbon nanotubes
Parallel flow
Current density
Demonstrations
Degradation

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Nihei, M., Horibe, M., Kawabata, A., & Awano, Y. (2004). Carbon nanotube vias for future LSI interconnects. In Proceedings of the IEEE 2004 International Interconnect Technology Conference (pp. 251-253)

Carbon nanotube vias for future LSI interconnects. / Nihei, Mizuhisa; Horibe, Masahiro; Kawabata, Akio; Awano, Yuji.

Proceedings of the IEEE 2004 International Interconnect Technology Conference. 2004. p. 251-253.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nihei, M, Horibe, M, Kawabata, A & Awano, Y 2004, Carbon nanotube vias for future LSI interconnects. in Proceedings of the IEEE 2004 International Interconnect Technology Conference. pp. 251-253, Proceedings of the IEEE 2004 International Interconnect Technology Conference, Burlingame, CA, United States, 04/6/7.
Nihei M, Horibe M, Kawabata A, Awano Y. Carbon nanotube vias for future LSI interconnects. In Proceedings of the IEEE 2004 International Interconnect Technology Conference. 2004. p. 251-253
Nihei, Mizuhisa ; Horibe, Masahiro ; Kawabata, Akio ; Awano, Yuji. / Carbon nanotube vias for future LSI interconnects. Proceedings of the IEEE 2004 International Interconnect Technology Conference. 2004. pp. 251-253
@inproceedings{841f87fc0a184adb948703f539a891a6,
title = "Carbon nanotube vias for future LSI interconnects",
abstract = "We have developed carbon nanotube (CNT) vias consisting of about 1000 tubes. The total resistance of the CNT via was measured as three orders of magnitude lower than that of one CNT, indicating that the current flows hi parallel through about 1000 tubes. There is no degradation observed for 100 hours at the via current density of 2×106 A/cm2, which is favorably compared with Cu vias. This is the first trial demonstration of CNT vias for future LSI interconnects.",
author = "Mizuhisa Nihei and Masahiro Horibe and Akio Kawabata and Yuji Awano",
year = "2004",
language = "English",
isbn = "0780383087",
pages = "251--253",
booktitle = "Proceedings of the IEEE 2004 International Interconnect Technology Conference",

}

TY - GEN

T1 - Carbon nanotube vias for future LSI interconnects

AU - Nihei, Mizuhisa

AU - Horibe, Masahiro

AU - Kawabata, Akio

AU - Awano, Yuji

PY - 2004

Y1 - 2004

N2 - We have developed carbon nanotube (CNT) vias consisting of about 1000 tubes. The total resistance of the CNT via was measured as three orders of magnitude lower than that of one CNT, indicating that the current flows hi parallel through about 1000 tubes. There is no degradation observed for 100 hours at the via current density of 2×106 A/cm2, which is favorably compared with Cu vias. This is the first trial demonstration of CNT vias for future LSI interconnects.

AB - We have developed carbon nanotube (CNT) vias consisting of about 1000 tubes. The total resistance of the CNT via was measured as three orders of magnitude lower than that of one CNT, indicating that the current flows hi parallel through about 1000 tubes. There is no degradation observed for 100 hours at the via current density of 2×106 A/cm2, which is favorably compared with Cu vias. This is the first trial demonstration of CNT vias for future LSI interconnects.

UR - http://www.scopus.com/inward/record.url?scp=8644228615&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=8644228615&partnerID=8YFLogxK

M3 - Conference contribution

SN - 0780383087

SP - 251

EP - 253

BT - Proceedings of the IEEE 2004 International Interconnect Technology Conference

ER -