Carbon nanotube vias for future LSI interconnects

Mizuhisa Nihei, Masahiro Horibe, Akio Kawabata, Yuji Awano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

65 Citations (Scopus)

Abstract

We have developed carbon nanotube (CNT) vias consisting of about 1000 tubes. The total resistance of the CNT via was measured as three orders of magnitude lower than that of one CNT, indicating that the current flows hi parallel through about 1000 tubes. There is no degradation observed for 100 hours at the via current density of 2×106 A/cm2, which is favorably compared with Cu vias. This is the first trial demonstration of CNT vias for future LSI interconnects.

Original languageEnglish
Title of host publicationProceedings of the IEEE 2004 International Interconnect Technology Conference
Pages251-253
Number of pages3
Publication statusPublished - 2004 Nov 25
Externally publishedYes
EventProceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, United States
Duration: 2004 Jun 72004 Jun 9

Publication series

NameProceedings of the IEEE 2004 International Interconnect Technology Conference

Other

OtherProceedings of the IEEE 2004 International Interconnect Technology Conference
CountryUnited States
CityBurlingame, CA
Period04/6/704/6/9

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Nihei, M., Horibe, M., Kawabata, A., & Awano, Y. (2004). Carbon nanotube vias for future LSI interconnects. In Proceedings of the IEEE 2004 International Interconnect Technology Conference (pp. 251-253). (Proceedings of the IEEE 2004 International Interconnect Technology Conference).