Carbon nanotube vias for future LSI interconnects

Mizuhisa Nihei; Masahiro Horibe; Akio Kawabata; Yuji Awano

Carbon nanotube vias for future LSI interconnects

Mizuhisa Nihei, Masahiro Horibe, Akio Kawabata, Yuji Awano

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We have developed carbon nanotube (CNT) vias consisting of about 1000 tubes. The total resistance of the CNT via was measured as three orders of magnitude lower than that of one CNT, indicating that the current flows hi parallel through about 1000 tubes. There is no degradation observed for 100 hours at the via current density of 2×10⁶ A/cm², which is favorably compared with Cu vias. This is the first trial demonstration of CNT vias for future LSI interconnects.

Original language	English
Title of host publication	Proceedings of the IEEE 2004 International Interconnect Technology Conference
Pages	251-253
Number of pages	3
Publication status	Published - 2004 Nov 25
Externally published	Yes
Event	Proceedings of the IEEE 2004 International Interconnect Technology Conference - Burlingame, CA, United States Duration: 2004 Jun 7 → 2004 Jun 9

Publication series

Name	Proceedings of the IEEE 2004 International Interconnect Technology Conference

Other

Other	Proceedings of the IEEE 2004 International Interconnect Technology Conference
Country/Territory	United States
City	Burlingame, CA
Period	04/6/7 → 04/6/9

ASJC Scopus subject areas

Engineering(all)

Cite this

Carbon nanotube vias for future LSI interconnects. / Nihei, Mizuhisa; Horibe, Masahiro; Kawabata, Akio et al.

Proceedings of the IEEE 2004 International Interconnect Technology Conference. 2004. p. 251-253 (Proceedings of the IEEE 2004 International Interconnect Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Nihei, M, Horibe, M, Kawabata, A & Awano, Y 2004, Carbon nanotube vias for future LSI interconnects. in Proceedings of the IEEE 2004 International Interconnect Technology Conference. Proceedings of the IEEE 2004 International Interconnect Technology Conference, pp. 251-253, Proceedings of the IEEE 2004 International Interconnect Technology Conference, Burlingame, CA, United States, 04/6/7.

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N2 - We have developed carbon nanotube (CNT) vias consisting of about 1000 tubes. The total resistance of the CNT via was measured as three orders of magnitude lower than that of one CNT, indicating that the current flows hi parallel through about 1000 tubes. There is no degradation observed for 100 hours at the via current density of 2×106 A/cm2, which is favorably compared with Cu vias. This is the first trial demonstration of CNT vias for future LSI interconnects.

AB - We have developed carbon nanotube (CNT) vias consisting of about 1000 tubes. The total resistance of the CNT via was measured as three orders of magnitude lower than that of one CNT, indicating that the current flows hi parallel through about 1000 tubes. There is no degradation observed for 100 hours at the via current density of 2×106 A/cm2, which is favorably compared with Cu vias. This is the first trial demonstration of CNT vias for future LSI interconnects.

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BT - Proceedings of the IEEE 2004 International Interconnect Technology Conference

T2 - Proceedings of the IEEE 2004 International Interconnect Technology Conference

Y2 - 7 June 2004 through 9 June 2004

ER -

Carbon nanotube vias for future LSI interconnects

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