Carbon Nanotubes for Interconnects

Mizuhisa Nihei, Motonobu Sato, Akio Kawabata, Shintaro Sato, Yuji Awano

Research output: Chapter in Book/Report/Conference proceedingChapter

1 Citation (Scopus)

Abstract

Carbon nanotubes (CNTs) exhibit excellent electrical properties that include a long mean free path, a high current-carrying capability and high thermal conductivity. Because of these factors, with their low electrical resistance and large electromigration tolerance, CNTs have been expected for use as aggressively scaled interconnects for next-generation LSIs. We report our trials of using CNT bundles as vertical interconnects, such as contact plugs on CMOS and vias on Cu wire.

Original languageEnglish
Title of host publicationAdvanced Interconnects for ULSI Technology
PublisherJohn Wiley and Sons
Pages491-502
Number of pages12
ISBN (Print)9780470662540
DOIs
Publication statusPublished - 2012 Feb 17

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Keywords

  • Carbon nanotube
  • Interconnect
  • Via

ASJC Scopus subject areas

  • Materials Science(all)

Cite this

Nihei, M., Sato, M., Kawabata, A., Sato, S., & Awano, Y. (2012). Carbon Nanotubes for Interconnects. In Advanced Interconnects for ULSI Technology (pp. 491-502). John Wiley and Sons. https://doi.org/10.1002/9781119963677.ch13