Castle of chips: A new chip stacking structure with wireless inductive coupling for large scale 3-D multicore systems

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

The number of stacked chips with wireless inductive coupling interconnect is limited by the physical space for bonding wires of supply voltage. A new chip stacking structure called CoC (Castle on Chips) is proposed for stacking a large number of chips without chip-to-chip wired interconnection. In the CoC, each chip has at least two sets of inductors, and is stacked on two chips in the lower layer shifting in the half chip size. Each chip takes a role of bridge of two chips in the lower layer and two in the upper layer. As examples of the CoC, the linear structure and circular structure are proposed. They form stairway boundary mesh structure, and a simple extension of Dimension Order Routing (DOR) can be deadlock free. The average distance of stairway boundary mesh is better than that of rectangular mesh, and sometimes comparable that of squire mesh. The circular stacking is advantageous when the number of stacking layers is strictly limited.

Original languageEnglish
Title of host publicationProceedings of the 2012 15th International Conference on Network-Based Information Systems, NBIS 2012
Pages820-825
Number of pages6
DOIs
Publication statusPublished - 2012
Event2012 15th International Conference on Network-Based Information Systems, NBIS 2012 - Melbourne, VIC, Australia
Duration: 2012 Sep 262012 Sep 28

Other

Other2012 15th International Conference on Network-Based Information Systems, NBIS 2012
CountryAustralia
CityMelbourne, VIC
Period12/9/2612/9/28

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Stairs
Wire
Electric potential

Keywords

  • 3-D System-in-a-Package
  • Chip Reuse
  • Interconnection Network
  • Wireless inductive coupling

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Information Systems

Cite this

Amano, H. (2012). Castle of chips: A new chip stacking structure with wireless inductive coupling for large scale 3-D multicore systems. In Proceedings of the 2012 15th International Conference on Network-Based Information Systems, NBIS 2012 (pp. 820-825). [6354931] https://doi.org/10.1109/NBiS.2012.82

Castle of chips : A new chip stacking structure with wireless inductive coupling for large scale 3-D multicore systems. / Amano, Hideharu.

Proceedings of the 2012 15th International Conference on Network-Based Information Systems, NBIS 2012. 2012. p. 820-825 6354931.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Amano, H 2012, Castle of chips: A new chip stacking structure with wireless inductive coupling for large scale 3-D multicore systems. in Proceedings of the 2012 15th International Conference on Network-Based Information Systems, NBIS 2012., 6354931, pp. 820-825, 2012 15th International Conference on Network-Based Information Systems, NBIS 2012, Melbourne, VIC, Australia, 12/9/26. https://doi.org/10.1109/NBiS.2012.82
Amano H. Castle of chips: A new chip stacking structure with wireless inductive coupling for large scale 3-D multicore systems. In Proceedings of the 2012 15th International Conference on Network-Based Information Systems, NBIS 2012. 2012. p. 820-825. 6354931 https://doi.org/10.1109/NBiS.2012.82
Amano, Hideharu. / Castle of chips : A new chip stacking structure with wireless inductive coupling for large scale 3-D multicore systems. Proceedings of the 2012 15th International Conference on Network-Based Information Systems, NBIS 2012. 2012. pp. 820-825
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