Cell manipulation by nodal circle resonance vibration of a cell cultivation substrate

Chikahiro Imashiro, Yuta Kurashina, Kenjiro Takemura, Shogo Miyata, Jun Komotori

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this paper, we propose a novel cell culture method to generate an organ without scaffold. The concept of our study is to apply the principle of Chladni's figures in cell manipulation. To confirm this concept, we developed cell cultivation device that can excite resonance vibration of the cell cultivation substrate. After the fabrication of the device, we estimated the resonance frequency and vibration amplitude distribution of our device. Since the fabricated device successfully produced the designed vibration mode, we conducted cell manipulation experiment to confirm our concept. In our experiment, we varied the initial number of cells that were seeded into our device. Cells were manipulated by resonance vibration for 120 min. After the manipulation, we checked cell distribution on the substrate. As a result, cells were successfully manipulated by the resonance vibration when the initial number of cells was appropriate.

Original languageEnglish
Title of host publication2015 IEEE International Ultrasonics Symposium, IUS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479981823
DOIs
Publication statusPublished - 2015 Nov 13
EventIEEE International Ultrasonics Symposium, IUS 2015 - Taipei, Taiwan, Province of China
Duration: 2015 Oct 212015 Oct 24

Other

OtherIEEE International Ultrasonics Symposium, IUS 2015
CountryTaiwan, Province of China
CityTaipei
Period15/10/2115/10/24

Keywords

  • cell manipulation
  • regenerative medicine
  • resonance vibration

ASJC Scopus subject areas

  • Acoustics and Ultrasonics

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  • Cite this

    Imashiro, C., Kurashina, Y., Takemura, K., Miyata, S., & Komotori, J. (2015). Cell manipulation by nodal circle resonance vibration of a cell cultivation substrate. In 2015 IEEE International Ultrasonics Symposium, IUS 2015 [7329291] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ULTSYM.2015.0430