Characterization of a bonding-in-liquid technique for liquid encapsulation into MEMS devices

Yoshiyuki Okayama, Keijiro Nakahara, Xavier Arouette, Takeshi Ninomiya, Yasuaki Matsumoto, Yoshinori Orimo, Atsushi Hotta, Masaki Omiya, Norihisa Miki

Research output: Contribution to journalArticlepeer-review

31 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds