Characterization of mechanical properties and residual stresses for Ni- Co thin films

Joong Hyok Ahn, Hong Yeol Bae, Yun Jae Kim, Jun Hyub Park

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The present work characterizes mechanical (elastic and plastic) properties and residual stresses of a Ni-Co thin film having 10-m thickness. Mechanical properties are obtained from direct-tension testing together with elastic finite element analysis. Membrane and bending components of residual stresses are measured using micro-cantilever and T-structure tests, respectively.

Original languageEnglish
Title of host publication17th European Conference on Fracture 2008
Subtitle of host publicationMultilevel Approach to Fracture of Materials, Components and Structures
Pages1770-1777
Number of pages8
Publication statusPublished - 2008 Dec 1
Externally publishedYes
Event17th European Conference on Fracture 2008: Multilevel Approach to Fracture of Materials, Components and Structures, ECF17 - Brno, Czech Republic
Duration: 2008 Sep 22008 Sep 5

Publication series

Name17th European Conference on Fracture 2008: Multilevel Approach to Fracture of Materials, Components and Structures
Volume3

Other

Other17th European Conference on Fracture 2008: Multilevel Approach to Fracture of Materials, Components and Structures, ECF17
CountryCzech Republic
CityBrno
Period08/9/208/9/5

Keywords

  • Elastic property
  • Ni-Co thin film
  • Plastic property
  • Residual stress

ASJC Scopus subject areas

  • Civil and Structural Engineering

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  • Cite this

    Ahn, J. H., Bae, H. Y., Kim, Y. J., & Park, J. H. (2008). Characterization of mechanical properties and residual stresses for Ni- Co thin films. In 17th European Conference on Fracture 2008: Multilevel Approach to Fracture of Materials, Components and Structures (pp. 1770-1777). (17th European Conference on Fracture 2008: Multilevel Approach to Fracture of Materials, Components and Structures; Vol. 3).