Chip Formation Behaviour in Ultra-Precision Cutting of Electroless Nickel Plated Mold Substrates

Jiwang Yan, T. Sasaki, J. Tamaki, A. Kubo, T. Sugino

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Electroless nickel plating is used in mold manufacturing industries as a surface processing technology for providing hard, ductile, wear resistant and corrosion-resistant surfaces. In this work, we conducted single point diamond turning experiments on electroless nickel plated substrates at machining scales from the nanometric to the micrometer level, and the machining behaviour was investigated through examining the chip morphology and surface texture. Emphatically, the effect of cutting fluid was investigated in detail. The results showed that the chip formation mechanisms in dry cuts and wet cuts are significantly different. Dry cuts cause splitting, adhesion, folding and secondary deformation of the chips, leading to surface defects. The results indicated that an effective supply of cutting fluid to the cutting region is essentially important to achieve high quality surfaces.

Original languageEnglish
Pages (from-to)3-8
Number of pages6
JournalKey Engineering Materials
Volume257-258
Publication statusPublished - 2004
Externally publishedYes

Fingerprint

Nickel
Cutting fluids
Machining
Substrates
Nickel plating
Diamond
Electroless plating
Surface defects
Surface properties
Diamonds
Adhesion
Textures
Wear of materials
Corrosion
Processing
Industry
Experiments

Keywords

  • Chip Formation
  • Cutting Fluid
  • Diamond Turning
  • Electroless Nickel Plating
  • Mold Fabrication
  • Surface Integrity
  • Ultra-Precision Cutting

ASJC Scopus subject areas

  • Ceramics and Composites
  • Chemical Engineering (miscellaneous)

Cite this

Chip Formation Behaviour in Ultra-Precision Cutting of Electroless Nickel Plated Mold Substrates. / Yan, Jiwang; Sasaki, T.; Tamaki, J.; Kubo, A.; Sugino, T.

In: Key Engineering Materials, Vol. 257-258, 2004, p. 3-8.

Research output: Contribution to journalArticle

Yan, Jiwang ; Sasaki, T. ; Tamaki, J. ; Kubo, A. ; Sugino, T. / Chip Formation Behaviour in Ultra-Precision Cutting of Electroless Nickel Plated Mold Substrates. In: Key Engineering Materials. 2004 ; Vol. 257-258. pp. 3-8.
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