Chip-to-chip inductive wireless power transmission system for SiP applications

Kohei Onizuka, Hiroshi Kawaguchi, Makoto Takamiya, Tadahiro Kuroda, Takayasu Sakurai

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    27 Citations (Scopus)

    Abstract

    A chip-to-chip inductive wireless power transmission system is proposed and the feasibility is experimentally demonstrated for the first time. The circuit realized 2.5mW power transmission at the output DC voltage of 0.5V using 700×700μm on-chip planar inductors for the transmitter and the receiver. Methods to optimize the circuit design about the maximum transmission power and the simulated optimization results are discussed.

    Original languageEnglish
    Title of host publicationProceedings of the IEEE 2006 Custom Integrated Circuits Conference, CICC 2006
    Pages575-578
    Number of pages4
    DOIs
    Publication statusPublished - 2006 Dec 1
    EventIEEE 2006 Custom Integrated Circuits Conference, CICC 2006 - San Jose, CA, United States
    Duration: 2006 Sep 102006 Sep 13

    Publication series

    NameProceedings of the Custom Integrated Circuits Conference
    ISSN (Print)0886-5930

    Other

    OtherIEEE 2006 Custom Integrated Circuits Conference, CICC 2006
    CountryUnited States
    CitySan Jose, CA
    Period06/9/1006/9/13

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

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  • Cite this

    Onizuka, K., Kawaguchi, H., Takamiya, M., Kuroda, T., & Sakurai, T. (2006). Chip-to-chip inductive wireless power transmission system for SiP applications. In Proceedings of the IEEE 2006 Custom Integrated Circuits Conference, CICC 2006 (pp. 575-578). [4115025] (Proceedings of the Custom Integrated Circuits Conference). https://doi.org/10.1109/CICC.2006.320994