Chip-to-chip inductive wireless power transmission system for SiP applications

Kohei Onizuka, Hiroshi Kawaguchi, Makoto Takamiya, Tadahiro Kuroda, Takayasu Sakurai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

27 Citations (Scopus)

Abstract

A chip-to-chip inductive wireless power transmission system is proposed and the feasibility is experimentally demonstrated for the first time. The circuit realized 2.5mW power transmission at the output DC voltage of 0.5V using 700×700μm on-chip planar inductors for the transmitter and the receiver. Methods to optimize the circuit design about the maximum transmission power and the simulated optimization results are discussed.

Original languageEnglish
Title of host publicationProceedings of the Custom Integrated Circuits Conference
Pages575-578
Number of pages4
DOIs
Publication statusPublished - 2006
EventIEEE 2006 Custom Integrated Circuits Conference, CICC 2006 - San Jose, CA, United States
Duration: 2006 Sep 102006 Sep 13

Other

OtherIEEE 2006 Custom Integrated Circuits Conference, CICC 2006
CountryUnited States
CitySan Jose, CA
Period06/9/1006/9/13

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Onizuka, K., Kawaguchi, H., Takamiya, M., Kuroda, T., & Sakurai, T. (2006). Chip-to-chip inductive wireless power transmission system for SiP applications. In Proceedings of the Custom Integrated Circuits Conference (pp. 575-578). [4115025] https://doi.org/10.1109/CICC.2006.320994