Circuit and device interactions for 3D integration using inductive coupling

Tadahiro Kuroda

doi:10.1109/IEDM.2014.7047079

Circuit and device interactions for 3D integration using inductive coupling

Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

This paper presents a ThruChip Interface using inductive coupling and Highly Doped Silicon Via for power delivery. Design automation, manufacturability, applications, and scaling scenario are discussed.

Original language	English
Title of host publication	2014 IEEE International Electron Devices Meeting, IEDM 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	18.6.1-18.6.4
Edition	February
ISBN (Electronic)	9781479980017
DOIs	https://doi.org/10.1109/IEDM.2014.7047079
Publication status	Published - 2015 Feb 20
Event	2014 60th IEEE International Electron Devices Meeting, IEDM 2014 - San Francisco, United States Duration: 2014 Dec 15 → 2014 Dec 17

Publication series

Name	Technical Digest - International Electron Devices Meeting, IEDM
Number	February
Volume	2015-February
ISSN (Print)	0163-1918

Other

Other	2014 60th IEEE International Electron Devices Meeting, IEDM 2014
Country/Territory	United States
City	San Francisco
Period	14/12/15 → 14/12/17

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

Access to Document

10.1109/IEDM.2014.7047079

Cite this

Kuroda, T. (2015). Circuit and device interactions for 3D integration using inductive coupling. In 2014 IEEE International Electron Devices Meeting, IEDM 2014 (February ed., pp. 18.6.1-18.6.4). [7047079] (Technical Digest - International Electron Devices Meeting, IEDM; Vol. 2015-February, No. February). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IEDM.2014.7047079

Circuit and device interactions for 3D integration using inductive coupling. / Kuroda, Tadahiro.
2014 IEEE International Electron Devices Meeting, IEDM 2014. February. ed. Institute of Electrical and Electronics Engineers Inc., 2015. p. 18.6.1-18.6.4 7047079 (Technical Digest - International Electron Devices Meeting, IEDM; Vol. 2015-February, No. February).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kuroda, T 2015, Circuit and device interactions for 3D integration using inductive coupling. in 2014 IEEE International Electron Devices Meeting, IEDM 2014. February edn, 7047079, Technical Digest - International Electron Devices Meeting, IEDM, no. February, vol. 2015-February, Institute of Electrical and Electronics Engineers Inc., pp. 18.6.1-18.6.4, 2014 60th IEEE International Electron Devices Meeting, IEDM 2014, San Francisco, United States, 14/12/15. https://doi.org/10.1109/IEDM.2014.7047079

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abstract = "This paper presents a ThruChip Interface using inductive coupling and Highly Doped Silicon Via for power delivery. Design automation, manufacturability, applications, and scaling scenario are discussed.",

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Circuit and device interactions for 3D integration using inductive coupling

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