Circuit and device interactions for 3D integration using inductive coupling

Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)

    Abstract

    This paper presents a ThruChip Interface using inductive coupling and Highly Doped Silicon Via for power delivery. Design automation, manufacturability, applications, and scaling scenario are discussed.

    Original languageEnglish
    Title of host publication2014 IEEE International Electron Devices Meeting, IEDM 2014
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    Pages18.6.1-18.6.4
    EditionFebruary
    ISBN (Electronic)9781479980017
    DOIs
    Publication statusPublished - 2015 Feb 20
    Event2014 60th IEEE International Electron Devices Meeting, IEDM 2014 - San Francisco, United States
    Duration: 2014 Dec 152014 Dec 17

    Publication series

    NameTechnical Digest - International Electron Devices Meeting, IEDM
    NumberFebruary
    Volume2015-February
    ISSN (Print)0163-1918

    Other

    Other2014 60th IEEE International Electron Devices Meeting, IEDM 2014
    CountryUnited States
    CitySan Francisco
    Period14/12/1514/12/17

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Electrical and Electronic Engineering
    • Materials Chemistry

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