CityFlow: Exploiting Edge Computing for Large Scale Smart City Applications

Nam Ky Giang, Victor C.M. Leung, Makoto Kawano, Takuro Yonezawa, Jin Nakazawa, Rodger Lea, Matt Broadbent

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents an approach to supporting the development process for large-scale smart city applications that leverage edge computing resources. A smart city testbed called CitiFlow is developed, which uses Distributed Node-RED as the underlying middleware to facilitate the decomposition and communication among sub components of large scale smart city applications. For the evaluation, a lab-based setup and a real world deployment were executed and are presented.

Original languageEnglish
Title of host publication2019 IEEE International Conference on Big Data and Smart Computing, BigComp 2019 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538677896
DOIs
Publication statusPublished - 2019 Apr 1
Event2019 IEEE International Conference on Big Data and Smart Computing, BigComp 2019 - Kyoto, Japan
Duration: 2019 Feb 272019 Mar 2

Publication series

Name2019 IEEE International Conference on Big Data and Smart Computing, BigComp 2019 - Proceedings

Conference

Conference2019 IEEE International Conference on Big Data and Smart Computing, BigComp 2019
CountryJapan
CityKyoto
Period19/2/2719/3/2

Keywords

  • Edge computing
  • Fog
  • IoT
  • Smart Cities

ASJC Scopus subject areas

  • Information Systems and Management
  • Artificial Intelligence
  • Computer Networks and Communications
  • Information Systems

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  • Cite this

    Giang, N. K., Leung, V. C. M., Kawano, M., Yonezawa, T., Nakazawa, J., Lea, R., & Broadbent, M. (2019). CityFlow: Exploiting Edge Computing for Large Scale Smart City Applications. In 2019 IEEE International Conference on Big Data and Smart Computing, BigComp 2019 - Proceedings [8679234] (2019 IEEE International Conference on Big Data and Smart Computing, BigComp 2019 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/BIGCOMP.2019.8679234