TY - GEN
T1 - Close-packed liquid-filled tunable microlens array
AU - Iimura, Yoshinobu
AU - Onoe, Hiroaki
AU - Takeuchi, Shoji
PY - 2014/1/1
Y1 - 2014/1/1
N2 - This paper describes close-packed liquid-filled tunable microlens arrays for optical devices such as integral imaging systems. These lenses are simply composed of poly(dimethylsiloxane) (PDMS) microchannels. Applied pressure deforms the top membrane of microchannels to form convex lenses. These lenses have three advantages: (i) Uniform deformation by pressure-driven actuation, (ii) Adjustable optical characteristics without patterned electrode, (iii) High-density integration of tunable microlenses. We fabricated three types of lenses: 'Honeycomb', 'Ladybird' and 'Spiderweb' as close-packed structure and showed that the 'Spiderweb' type packing is the most suitable for close packing. We believe that these lenses can be applied to optical applications such as 3D displays based on integral photography.
AB - This paper describes close-packed liquid-filled tunable microlens arrays for optical devices such as integral imaging systems. These lenses are simply composed of poly(dimethylsiloxane) (PDMS) microchannels. Applied pressure deforms the top membrane of microchannels to form convex lenses. These lenses have three advantages: (i) Uniform deformation by pressure-driven actuation, (ii) Adjustable optical characteristics without patterned electrode, (iii) High-density integration of tunable microlenses. We fabricated three types of lenses: 'Honeycomb', 'Ladybird' and 'Spiderweb' as close-packed structure and showed that the 'Spiderweb' type packing is the most suitable for close packing. We believe that these lenses can be applied to optical applications such as 3D displays based on integral photography.
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U2 - 10.1109/MEMSYS.2014.6765853
DO - 10.1109/MEMSYS.2014.6765853
M3 - Conference contribution
AN - SCOPUS:84898937205
SN - 9781479935086
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 1163
EP - 1166
BT - MEMS 2014 - 27th IEEE International Conference on Micro Electro Mechanical Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 27th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2014
Y2 - 26 January 2014 through 30 January 2014
ER -