Comparison of self-heating effect (SHE) in short-channel bulk and ultra-thin BOX SOI MOSFETs: Impacts of doped well, ambient temperature, and SOI/BOX thicknesses on SHE

Tsunaki Takahashi, Takeo Matsuki, Takahiro Shinada, Yasuo Inoue, Ken Uchida

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    15 Citations (Scopus)

    Abstract

    Self-heating effects (SHEs) of bulk and SOI FETs including 6-nm ultra-thin (UT) BOX devices are systematically investigated and compared using the four-terminal gate resistance technique. For bulk FETs, it has been verified for the first time that the SHE is not negligible in nanoscale devices mainly owing to a decrease in the thermal conductivity of the more heavily doped well. Furthermore, it has been demonstrated that the magnitude of the SHE strongly depends on the chip (ambient) temperature (Tchip). For SOI FETs, the impacts of BOX/SOI thinning are evaluated and explained in terms of the thermal conductivities of materials within heat dissipation paths. It has been demonstrated that the device temperature of 6-nm UT BOX SOI FETs is close to that of bulk FETs at Tchip under operating conditions. A thermal-aware device design of the UT Body and BOX (UTBB) structure is proposed on the basis of the evaluated BOX/SOI thickness dependences of the SHE. The SHE of UTBB FETs with a raised source/drain and/or shorter contact pitch could be comparable to that of bulk FETs in deeply scaled nodes. In addition, the doping concentration under the BOX should be optimized in order to achieve low and Tchip-independent SHE.

    Original languageEnglish
    Title of host publication2013 IEEE International Electron Devices Meeting, IEDM 2013
    Pages7.4.1-7.4.4
    DOIs
    Publication statusPublished - 2013 Dec 1
    Event2013 IEEE International Electron Devices Meeting, IEDM 2013 - Washington, DC, United States
    Duration: 2013 Dec 92013 Dec 11

    Publication series

    NameTechnical Digest - International Electron Devices Meeting, IEDM
    ISSN (Print)0163-1918

    Other

    Other2013 IEEE International Electron Devices Meeting, IEDM 2013
    CountryUnited States
    CityWashington, DC
    Period13/12/913/12/11

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Electrical and Electronic Engineering
    • Materials Chemistry

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  • Cite this

    Takahashi, T., Matsuki, T., Shinada, T., Inoue, Y., & Uchida, K. (2013). Comparison of self-heating effect (SHE) in short-channel bulk and ultra-thin BOX SOI MOSFETs: Impacts of doped well, ambient temperature, and SOI/BOX thicknesses on SHE. In 2013 IEEE International Electron Devices Meeting, IEDM 2013 (pp. 7.4.1-7.4.4). [6724581] (Technical Digest - International Electron Devices Meeting, IEDM). https://doi.org/10.1109/IEDM.2013.6724581