Contribution of plastic dissipation to interfacial adhesion in IC metallization systems

M. Omiya, S. Kamiya, H. Shimomura, T. Suzuki

Research output: Contribution to conferencePaper

Abstract

In order to evaluate local adhesion of interface in thin film stuck, a new micro-scale technique has been developed. The new micro-scale technique was simulated by finite element analysis and the contribution of plastic dissipation to interfacial adhesion was evaluated. In the micro-scale technique, the interface adhesion was evaluated to be 5.0±0.9 J/m2 in the numerical simulation of interface crack extension behavior. However, by eliminating additional energy which was dissipated with the plastic deformation close to the interface crack tip, the interface adhesion was evaluated to be 3.0 J/m2. This result indicates that the large amount of plastic dissipation occurred near the interface crack tip and it is necessary to consider the plastic dissipation in the evaluation of interfacial adhesion in Cu metallization systems.

Original languageEnglish
Publication statusPublished - 2010 Dec 1
Event18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale, ECF 2010 - Dresden, Germany
Duration: 2010 Aug 302010 Sep 3

Other

Other18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale, ECF 2010
CountryGermany
CityDresden
Period10/8/3010/9/3

Keywords

  • Adhesion strength
  • Copper metal line
  • Integrated circuits
  • Interface
  • Plastic deformation

ASJC Scopus subject areas

  • Mechanics of Materials

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    Omiya, M., Kamiya, S., Shimomura, H., & Suzuki, T. (2010). Contribution of plastic dissipation to interfacial adhesion in IC metallization systems. Paper presented at 18th European Conference on Fracture: Fracture of Materials and Structures from Micro to Macro Scale, ECF 2010, Dresden, Germany.