Crack-free ductile mode grinding of fused silica under controllable dry grinding conditions

Wei Wang, Peng Yao, Jun Wang, Chuanzhen Huang, Hongtao Zhu, Bin Zou, Hanlian Liu, Jiwang Yan

Research output: Contribution to journalArticle

31 Citations (Scopus)

Abstract

A crack-free ductile mode grinding of fused silica was realized by a controllable dry grinding process in this research, which is attributed to the improvement of fused silica's ductile machinability induced by the high grinding temperature. The plastic deformation of fused silica consists of shear flow and densification. Plastic deformation mechanisms and cracking behaviors related to densification were investigated firstly by high temperature nanoindentation experiments to reveal the ductile–brittle transition mechanisms. Fused silica exhibits less densification and more shear flow at high temperature than room temperature. The critical ductile–brittle transition load of fused silica is higher at high temperature than room temperature. These results may lead to the improvement of the fused silica's ductile machinability at high temperature. Dry grinding experiments were conducted to investigate the effect of grinding depth. A mathematical model is established to predict the maximum temperature in workpiece. A novel infrared radiation (IR) transmission on-line measurement method was presented to acquire the workpiece temperature in the contact zone directly. The predicted results coincide well with the experiment results. Contrary to the conventional experience, a large grinding depth is beneficial for the surface quality and integrity in the dry grinding of fused silica due to the increased grinding temperature; however, the excessive grinding depth results in grinding wheel burn. The ductile grinding depth of the fused silica increases from sub-micrometers to 5 μm by dry grinding which makes the grinding process more controllable and effective.

Original languageEnglish
Pages (from-to)126-136
Number of pages11
JournalInternational Journal of Machine Tools and Manufacture
Volume109
DOIs
Publication statusPublished - 2016 Oct 1

Keywords

  • Ductile mode grinding
  • Fused silica
  • Grinding temperature
  • High temperature nanoindentation
  • Infrared radiation
  • Material densification

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

Fingerprint Dive into the research topics of 'Crack-free ductile mode grinding of fused silica under controllable dry grinding conditions'. Together they form a unique fingerprint.

  • Cite this