Cross talk countermeasures in inductive inter-chip wireless superconnect

Noriyuki Miura; Daisuke Mizoguchi; Takayasu Sakurai; Tadahiro Kuroda

Cross talk countermeasures in inductive inter-chip wireless superconnect

Noriyuki Miura, Daisuke Mizoguchi, Takayasu Sakurai, Tadahiro Kuroda

Research output: Contribution to journal › Conference article › peer-review

Abstract

Inductive coupling among stacked chips in a package enables 1.2Gb/s/channel data communications. Array arrangement of the channel increases data bandwidth, while signal may be degraded by cross talk. In this paper, cross talk is measured and analyzed, and cross talk countermeasures are discussed for the first time. Received signal waveforms by the inductive coupling are measured by embedded voltage detectors on a test chip. Interference-to-Signal Ratio (ISR) has good agreements between the measurements and calculations from a theoretical model. It is found that cross talk is reduced to negligibly small at a certain distance. If the channels are arranged at intervals of this distance, ISR is minimized. A technique based on Time Division Multiple Access (TDMA) is also proposed to further reduce cross talk.

Original language	English
Pages (from-to)	99-102
Number of pages	4
Journal	Proceedings of the Custom Integrated Circuits Conference
Publication status	Published - 2004 Dec 1
Event	Proceedings of the IEEE 2004 Custom Integrated Circuits Conference, CICC - Orlando, FL, United States Duration: 2004 Oct 3 → 2004 Oct 6

ASJC Scopus subject areas

Electrical and Electronic Engineering

Cite this

@article{60a98e9378b8492fbf66cee4bd990a59,

title = "Cross talk countermeasures in inductive inter-chip wireless superconnect",

abstract = "Inductive coupling among stacked chips in a package enables 1.2Gb/s/channel data communications. Array arrangement of the channel increases data bandwidth, while signal may be degraded by cross talk. In this paper, cross talk is measured and analyzed, and cross talk countermeasures are discussed for the first time. Received signal waveforms by the inductive coupling are measured by embedded voltage detectors on a test chip. Interference-to-Signal Ratio (ISR) has good agreements between the measurements and calculations from a theoretical model. It is found that cross talk is reduced to negligibly small at a certain distance. If the channels are arranged at intervals of this distance, ISR is minimized. A technique based on Time Division Multiple Access (TDMA) is also proposed to further reduce cross talk.",

author = "Noriyuki Miura and Daisuke Mizoguchi and Takayasu Sakurai and Tadahiro Kuroda",

year = "2004",

month = dec,

day = "1",

language = "English",

pages = "99--102",

journal = "Proceedings of the Custom Integrated Circuits Conference",

issn = "0886-5930",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "Proceedings of the IEEE 2004 Custom Integrated Circuits Conference, CICC ; Conference date: 03-10-2004 Through 06-10-2004",

}

TY - JOUR

T1 - Cross talk countermeasures in inductive inter-chip wireless superconnect

AU - Miura, Noriyuki

AU - Mizoguchi, Daisuke

AU - Sakurai, Takayasu

AU - Kuroda, Tadahiro

PY - 2004/12/1

Y1 - 2004/12/1

N2 - Inductive coupling among stacked chips in a package enables 1.2Gb/s/channel data communications. Array arrangement of the channel increases data bandwidth, while signal may be degraded by cross talk. In this paper, cross talk is measured and analyzed, and cross talk countermeasures are discussed for the first time. Received signal waveforms by the inductive coupling are measured by embedded voltage detectors on a test chip. Interference-to-Signal Ratio (ISR) has good agreements between the measurements and calculations from a theoretical model. It is found that cross talk is reduced to negligibly small at a certain distance. If the channels are arranged at intervals of this distance, ISR is minimized. A technique based on Time Division Multiple Access (TDMA) is also proposed to further reduce cross talk.

AB - Inductive coupling among stacked chips in a package enables 1.2Gb/s/channel data communications. Array arrangement of the channel increases data bandwidth, while signal may be degraded by cross talk. In this paper, cross talk is measured and analyzed, and cross talk countermeasures are discussed for the first time. Received signal waveforms by the inductive coupling are measured by embedded voltage detectors on a test chip. Interference-to-Signal Ratio (ISR) has good agreements between the measurements and calculations from a theoretical model. It is found that cross talk is reduced to negligibly small at a certain distance. If the channels are arranged at intervals of this distance, ISR is minimized. A technique based on Time Division Multiple Access (TDMA) is also proposed to further reduce cross talk.

UR - http://www.scopus.com/inward/record.url?scp=17044430928&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=17044430928&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:17044430928

SN - 0886-5930

SP - 99

EP - 102

JO - Proceedings of the Custom Integrated Circuits Conference

JF - Proceedings of the Custom Integrated Circuits Conference

T2 - Proceedings of the IEEE 2004 Custom Integrated Circuits Conference, CICC

Y2 - 3 October 2004 through 6 October 2004

ER -

Cross talk countermeasures in inductive inter-chip wireless superconnect

Abstract

ASJC Scopus subject areas

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