Crosstalk countermeasures for high-density inductive-coupling channel array

Noriyuki Miura, Takayasu Sakurai, Tadahiro Kuroda

Research output: Contribution to journalArticle

21 Citations (Scopus)

Abstract

Inductive coupling among stacked chips in a package enables 1 Gb/s/channel data communications. Array arrangement of the channel increases data bandwidth, while signal may be degraded by crosstalk. In this paper, crosstalk is measured and analyzed, and crosstalk countermeasures are discussed. Received signal waveforms through the inductive coupling are measured by embedded voltage detectors on a test chip. Interference-to-signal ratio (ISR) has good agreement between the measurements and calculations. It is found that crosstalk is reduced negligibly at a certain distance. If the channels are arranged at intervals of this distance, ISR is minimized. A technique based on time interleaving is also proposed to further reduce crosstalk. A 3 × 17 channel array is implemented with the crosstalk countermeasures. The channel pitch is taken down to 50 μm. Inter-chip communication with data rate of 1 Gb/s/channel and bit error rate (BER) lower than 10-9 is demonstrated.

Original languageEnglish
Pages (from-to)410-421
Number of pages12
JournalIEEE Journal of Solid-State Circuits
Volume42
Issue number2
DOIs
Publication statusPublished - 2007 Feb

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Crosstalk
Radar countermeasures
Communication
Bit error rate
Detectors
Bandwidth
Electric potential

Keywords

  • Crosstalk
  • Inductor
  • SiP
  • Three-dimensional
  • Wireless interconnect

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Crosstalk countermeasures for high-density inductive-coupling channel array. / Miura, Noriyuki; Sakurai, Takayasu; Kuroda, Tadahiro.

In: IEEE Journal of Solid-State Circuits, Vol. 42, No. 2, 02.2007, p. 410-421.

Research output: Contribution to journalArticle

@article{6a57f73fcf8b4c6c81d6f7f733b98660,
title = "Crosstalk countermeasures for high-density inductive-coupling channel array",
abstract = "Inductive coupling among stacked chips in a package enables 1 Gb/s/channel data communications. Array arrangement of the channel increases data bandwidth, while signal may be degraded by crosstalk. In this paper, crosstalk is measured and analyzed, and crosstalk countermeasures are discussed. Received signal waveforms through the inductive coupling are measured by embedded voltage detectors on a test chip. Interference-to-signal ratio (ISR) has good agreement between the measurements and calculations. It is found that crosstalk is reduced negligibly at a certain distance. If the channels are arranged at intervals of this distance, ISR is minimized. A technique based on time interleaving is also proposed to further reduce crosstalk. A 3 × 17 channel array is implemented with the crosstalk countermeasures. The channel pitch is taken down to 50 μm. Inter-chip communication with data rate of 1 Gb/s/channel and bit error rate (BER) lower than 10-9 is demonstrated.",
keywords = "Crosstalk, Inductor, SiP, Three-dimensional, Wireless interconnect",
author = "Noriyuki Miura and Takayasu Sakurai and Tadahiro Kuroda",
year = "2007",
month = "2",
doi = "10.1109/JSSC.2006.889354",
language = "English",
volume = "42",
pages = "410--421",
journal = "IEEE Journal of Solid-State Circuits",
issn = "0018-9200",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "2",

}

TY - JOUR

T1 - Crosstalk countermeasures for high-density inductive-coupling channel array

AU - Miura, Noriyuki

AU - Sakurai, Takayasu

AU - Kuroda, Tadahiro

PY - 2007/2

Y1 - 2007/2

N2 - Inductive coupling among stacked chips in a package enables 1 Gb/s/channel data communications. Array arrangement of the channel increases data bandwidth, while signal may be degraded by crosstalk. In this paper, crosstalk is measured and analyzed, and crosstalk countermeasures are discussed. Received signal waveforms through the inductive coupling are measured by embedded voltage detectors on a test chip. Interference-to-signal ratio (ISR) has good agreement between the measurements and calculations. It is found that crosstalk is reduced negligibly at a certain distance. If the channels are arranged at intervals of this distance, ISR is minimized. A technique based on time interleaving is also proposed to further reduce crosstalk. A 3 × 17 channel array is implemented with the crosstalk countermeasures. The channel pitch is taken down to 50 μm. Inter-chip communication with data rate of 1 Gb/s/channel and bit error rate (BER) lower than 10-9 is demonstrated.

AB - Inductive coupling among stacked chips in a package enables 1 Gb/s/channel data communications. Array arrangement of the channel increases data bandwidth, while signal may be degraded by crosstalk. In this paper, crosstalk is measured and analyzed, and crosstalk countermeasures are discussed. Received signal waveforms through the inductive coupling are measured by embedded voltage detectors on a test chip. Interference-to-signal ratio (ISR) has good agreement between the measurements and calculations. It is found that crosstalk is reduced negligibly at a certain distance. If the channels are arranged at intervals of this distance, ISR is minimized. A technique based on time interleaving is also proposed to further reduce crosstalk. A 3 × 17 channel array is implemented with the crosstalk countermeasures. The channel pitch is taken down to 50 μm. Inter-chip communication with data rate of 1 Gb/s/channel and bit error rate (BER) lower than 10-9 is demonstrated.

KW - Crosstalk

KW - Inductor

KW - SiP

KW - Three-dimensional

KW - Wireless interconnect

UR - http://www.scopus.com/inward/record.url?scp=33847714355&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33847714355&partnerID=8YFLogxK

U2 - 10.1109/JSSC.2006.889354

DO - 10.1109/JSSC.2006.889354

M3 - Article

VL - 42

SP - 410

EP - 421

JO - IEEE Journal of Solid-State Circuits

JF - IEEE Journal of Solid-State Circuits

SN - 0018-9200

IS - 2

ER -