Crosstalk Rejection in 3-D-Stacked Interchip Communication with Blind Source Separation

Kamal El-Sankary, Tetsuya Asai, Masato Motomura, Tadahiro Kuroda

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

A blind source separation (BSS) is proposed to reject the crosstalk between inductive-coupling channels in 3-D systems. The phase and permutation ambiguities inherent to BSS are compensated for in the proposed technique. A continuous-time natural gradient BSS with integrator output swing bounding, which is amenable for high-speed implementation, is also proposed. Techniques to reduce the implementation complexity for a large channel array are presented. The proposed technique shows substantial improvement results for crosstalk rejection in a high-crosstalk-coupling environment. In addition, for a 3 × 3 array channel with 1 Gb/s/channel, with a crosstalk-to-signal ratio of -3 dB, a bit-error rate of 10<sup>-11</sup> is obtained compared to 10<sup>-4</sup> without BSS.

Original languageEnglish
Article number7064710
Pages (from-to)726-730
Number of pages5
JournalIEEE Transactions on Circuits and Systems II: Express Briefs
Volume62
Issue number8
DOIs
Publication statusPublished - 2015 Aug 1

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Blind source separation
Crosstalk
Communication
Bit error rate

Keywords

  • Blind source separation (BSS)
  • crosstalk rejection
  • interchip communication
  • three-dimensional (3-D) integrated circuits (ICs)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Crosstalk Rejection in 3-D-Stacked Interchip Communication with Blind Source Separation. / El-Sankary, Kamal; Asai, Tetsuya; Motomura, Masato; Kuroda, Tadahiro.

In: IEEE Transactions on Circuits and Systems II: Express Briefs, Vol. 62, No. 8, 7064710, 01.08.2015, p. 726-730.

Research output: Contribution to journalArticle

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