This paper presents a dicing method for MEMS devices without dameges during the dicing process. The method is based on bonding and detachment of a glass cap plate by using thermoplastic adhesive. Sand blast technique was used for the fabrication of glass cap plate which has concavities in the depth of 100^m. The thermoplastic adhesive was screen printed on the glass plate. The plate was thermocompression-bonded to silicon wafer at 210°C and diced to individual chips without damages from water or dicing dusts. The chip was mounted in the package while the glass cap was removed at 330C.
- damage free
- thermoplastic adhesive
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering