Densely packed N×N wavelength cross-connect switch module

Hisato Uetsuka, Masao Tachikura, Hitoshi Kawashima, Kazuhiko Ikeda, Keisuke Sorimoto, Hiroyuki Tsuda, Keiichi Sasaki, Yuto Yamashita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A wavelength cross-connect switch (WXC) is proposed and demonstrated. The cross-connect optics have orthogonal imaging systems that operate differently in the switching and spectral planes. The switching plane has 2f Fourier optics with a Rayleigh length. On the other hand, the spectral plane has 4f imaging optics. Two types of switching engines, microelectromechanical system (MEMS) mirrors and liquid crystal on silicon (LCOS), are applied for the same cross-connect optics. The 5×5 WXC with MEMS mirrors has a 100 GHz channel spacing, which is compatible with the International Telecommunication Union (ITU) grid. On the other hand, the WXC with LCOS has a variable channel spacing. The characteristics of two types of WXC are compared. In addition, the port count, which is one of the important parameters, is discussed.

Original languageEnglish
Title of host publicationNext-Generation Optical Communication
Subtitle of host publicationComponents, Sub-Systems, and Systems IV
EditorsGuifang Li, Xiang Zhou
PublisherSPIE
ISBN (Electronic)9781628414790
DOIs
Publication statusPublished - 2015 Jan 1
EventNext-Generation Optical Communication: Components, Sub-Systems, and Systems IV - San Francisco, United States
Duration: 2015 Feb 102015 Feb 12

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume9389
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Other

OtherNext-Generation Optical Communication: Components, Sub-Systems, and Systems IV
CountryUnited States
CitySan Francisco
Period15/2/1015/2/12

    Fingerprint

Keywords

  • Liquid crystal on silicon
  • MEMS
  • ROADM
  • Wavelength cross-connect switch

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

Uetsuka, H., Tachikura, M., Kawashima, H., Ikeda, K., Sorimoto, K., Tsuda, H., Sasaki, K., & Yamashita, Y. (2015). Densely packed N×N wavelength cross-connect switch module. In G. Li, & X. Zhou (Eds.), Next-Generation Optical Communication: Components, Sub-Systems, and Systems IV [93890C] (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 9389). SPIE. https://doi.org/10.1117/12.2078608