Densely packed N×N wavelength cross-connect switch module

Hisato Uetsuka, Masao Tachikura, Hitoshi Kawashima, Kazuhiko Ikeda, Keisuke Sorimoto, Hiroyuki Tsuda, Keiichi Sasaki, Yuto Yamashita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A wavelength cross-connect switch (WXC) is proposed and demonstrated. The cross-connect optics have orthogonal imaging systems that operate differently in the switching and spectral planes. The switching plane has 2f Fourier optics with a Rayleigh length. On the other hand, the spectral plane has 4f imaging optics. Two types of switching engines, microelectromechanical system (MEMS) mirrors and liquid crystal on silicon (LCOS), are applied for the same cross-connect optics. The 5×5 WXC with MEMS mirrors has a 100 GHz channel spacing, which is compatible with the International Telecommunication Union (ITU) grid. On the other hand, the WXC with LCOS has a variable channel spacing. The characteristics of two types of WXC are compared. In addition, the port count, which is one of the important parameters, is discussed.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
PublisherSPIE
Volume9389
ISBN (Print)9781628414790
DOIs
Publication statusPublished - 2015
EventNext-Generation Optical Communication: Components, Sub-Systems, and Systems IV - San Francisco, United States
Duration: 2015 Feb 102015 Feb 12

Other

OtherNext-Generation Optical Communication: Components, Sub-Systems, and Systems IV
CountryUnited States
CitySan Francisco
Period15/2/1015/2/12

Fingerprint

Optics
Liquid Crystals
Switch
switches
modules
Switches
Silicon
optics
Wavelength
Micro-electro-mechanical Systems
Liquid Crystal
Module
Liquid crystals
MEMS
Spacing
Mirror
Fourier Optics
Fourier optics
wavelengths
microelectromechanical systems

Keywords

  • Liquid crystal on silicon
  • MEMS
  • ROADM
  • Wavelength cross-connect switch

ASJC Scopus subject areas

  • Applied Mathematics
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Uetsuka, H., Tachikura, M., Kawashima, H., Ikeda, K., Sorimoto, K., Tsuda, H., ... Yamashita, Y. (2015). Densely packed N×N wavelength cross-connect switch module. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 9389). [93890C] SPIE. https://doi.org/10.1117/12.2078608

Densely packed N×N wavelength cross-connect switch module. / Uetsuka, Hisato; Tachikura, Masao; Kawashima, Hitoshi; Ikeda, Kazuhiko; Sorimoto, Keisuke; Tsuda, Hiroyuki; Sasaki, Keiichi; Yamashita, Yuto.

Proceedings of SPIE - The International Society for Optical Engineering. Vol. 9389 SPIE, 2015. 93890C.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Uetsuka, H, Tachikura, M, Kawashima, H, Ikeda, K, Sorimoto, K, Tsuda, H, Sasaki, K & Yamashita, Y 2015, Densely packed N×N wavelength cross-connect switch module. in Proceedings of SPIE - The International Society for Optical Engineering. vol. 9389, 93890C, SPIE, Next-Generation Optical Communication: Components, Sub-Systems, and Systems IV, San Francisco, United States, 15/2/10. https://doi.org/10.1117/12.2078608
Uetsuka H, Tachikura M, Kawashima H, Ikeda K, Sorimoto K, Tsuda H et al. Densely packed N×N wavelength cross-connect switch module. In Proceedings of SPIE - The International Society for Optical Engineering. Vol. 9389. SPIE. 2015. 93890C https://doi.org/10.1117/12.2078608
Uetsuka, Hisato ; Tachikura, Masao ; Kawashima, Hitoshi ; Ikeda, Kazuhiko ; Sorimoto, Keisuke ; Tsuda, Hiroyuki ; Sasaki, Keiichi ; Yamashita, Yuto. / Densely packed N×N wavelength cross-connect switch module. Proceedings of SPIE - The International Society for Optical Engineering. Vol. 9389 SPIE, 2015.
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