Dependence of magnetization switching property with microwave assistance on anisotropy field for ECC nano-pillar

Naoyuki Narita, Terumitsu Tanaka, Ayumu Kato, Kimihide Matsuyama, Yukio Nozaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Magnetic resonance properties for ECC nano-pillar were numerically analyzed. The analysis showed there are three resonance modes in the ECC nano-pillar that ferromagnetic resonances (FMR) at the low and high frequency regions associating with the soft and hard material, and magnetic spin wave resonance at middle frequency region. Microwave assisted magnetization reversals were also simulated assuming ECC nano-pillar with extremely high anisotropy field hard magnetic material. Essential ac field strength and microwave frequency for magnetization reversal were found to be less dependent on anisotropy field for the hard magnetic material, when magnetization reversal is induced by magnetic resonance for the soft magnetic material.

Original languageEnglish
Title of host publicationTENCON 2010 - 2010 IEEE Region 10 Conference
Pages1898-1901
Number of pages4
DOIs
Publication statusPublished - 2010 Dec 1
Event2010 IEEE Region 10 Conference, TENCON 2010 - Fukuoka, Japan
Duration: 2010 Nov 212010 Nov 24

Publication series

NameIEEE Region 10 Annual International Conference, Proceedings/TENCON

Other

Other2010 IEEE Region 10 Conference, TENCON 2010
CountryJapan
CityFukuoka
Period10/11/2110/11/24

Keywords

  • Exchange-coupled-composite media
  • Ferromagnetic resonance
  • Microwave-assisted magnetization reversal
  • Spin wave resonance

ASJC Scopus subject areas

  • Computer Science Applications
  • Electrical and Electronic Engineering

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  • Cite this

    Narita, N., Tanaka, T., Kato, A., Matsuyama, K., & Nozaki, Y. (2010). Dependence of magnetization switching property with microwave assistance on anisotropy field for ECC nano-pillar. In TENCON 2010 - 2010 IEEE Region 10 Conference (pp. 1898-1901). [5686413] (IEEE Region 10 Annual International Conference, Proceedings/TENCON). https://doi.org/10.1109/TENCON.2010.5686413