Deposition of functional membranes by through-substrate plane-plate dielectric-barrier discharge

H. Kobayashi, H. Kakiuchi, K. Yasutake, Tetsuya Suzuki, M. Noborisaka, N. Negishi

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

A novel roll-to-roll deposition method, namely, "through-substrate plane-plate dielectric-barrier discharge," was developed. This method uses a dielectric-barrier-discharge plasma plate, which has antenna and ground lines in a dielectric material, as an electrode. A film substrate was placed on the electrode so that an electric field, which passes through the substrate, generates a plasma above surface of the substrate. This method can avoid unexpected deposition on the electrode, which causes dust-particle contamination. In a preliminary experiment, deposition rates of Si, SiN, and Diamond-Like-Carbon were about 1, 1.5 and 5 μm/min, respectively. When there was a space between the plasma plate and the substrate film, plasma was generated on the back side of the substrate film, and then the deposition on the surface of the substrate film was prevented. This back-side discharge was suppressed by supplying nitrogen gas to the back-side of the substrate film.

Original languageEnglish
Article number012024
JournalJournal of Physics: Conference Series
Volume441
Issue number1
DOIs
Publication statusPublished - 2013

Fingerprint

membranes
electrodes
supplying
plasma jets
contamination
antennas
dust
diamonds
nitrogen
electric fields
causes
carbon
gases

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

Deposition of functional membranes by through-substrate plane-plate dielectric-barrier discharge. / Kobayashi, H.; Kakiuchi, H.; Yasutake, K.; Suzuki, Tetsuya; Noborisaka, M.; Negishi, N.

In: Journal of Physics: Conference Series, Vol. 441, No. 1, 012024, 2013.

Research output: Contribution to journalArticle

Kobayashi, H. ; Kakiuchi, H. ; Yasutake, K. ; Suzuki, Tetsuya ; Noborisaka, M. ; Negishi, N. / Deposition of functional membranes by through-substrate plane-plate dielectric-barrier discharge. In: Journal of Physics: Conference Series. 2013 ; Vol. 441, No. 1.
@article{4c32c3a8a42f42359c552c24ce4209b4,
title = "Deposition of functional membranes by through-substrate plane-plate dielectric-barrier discharge",
abstract = "A novel roll-to-roll deposition method, namely, {"}through-substrate plane-plate dielectric-barrier discharge,{"} was developed. This method uses a dielectric-barrier-discharge plasma plate, which has antenna and ground lines in a dielectric material, as an electrode. A film substrate was placed on the electrode so that an electric field, which passes through the substrate, generates a plasma above surface of the substrate. This method can avoid unexpected deposition on the electrode, which causes dust-particle contamination. In a preliminary experiment, deposition rates of Si, SiN, and Diamond-Like-Carbon were about 1, 1.5 and 5 μm/min, respectively. When there was a space between the plasma plate and the substrate film, plasma was generated on the back side of the substrate film, and then the deposition on the surface of the substrate film was prevented. This back-side discharge was suppressed by supplying nitrogen gas to the back-side of the substrate film.",
author = "H. Kobayashi and H. Kakiuchi and K. Yasutake and Tetsuya Suzuki and M. Noborisaka and N. Negishi",
year = "2013",
doi = "10.1088/1742-6596/441/1/012024",
language = "English",
volume = "441",
journal = "Journal of Physics: Conference Series",
issn = "1742-6588",
publisher = "IOP Publishing Ltd.",
number = "1",

}

TY - JOUR

T1 - Deposition of functional membranes by through-substrate plane-plate dielectric-barrier discharge

AU - Kobayashi, H.

AU - Kakiuchi, H.

AU - Yasutake, K.

AU - Suzuki, Tetsuya

AU - Noborisaka, M.

AU - Negishi, N.

PY - 2013

Y1 - 2013

N2 - A novel roll-to-roll deposition method, namely, "through-substrate plane-plate dielectric-barrier discharge," was developed. This method uses a dielectric-barrier-discharge plasma plate, which has antenna and ground lines in a dielectric material, as an electrode. A film substrate was placed on the electrode so that an electric field, which passes through the substrate, generates a plasma above surface of the substrate. This method can avoid unexpected deposition on the electrode, which causes dust-particle contamination. In a preliminary experiment, deposition rates of Si, SiN, and Diamond-Like-Carbon were about 1, 1.5 and 5 μm/min, respectively. When there was a space between the plasma plate and the substrate film, plasma was generated on the back side of the substrate film, and then the deposition on the surface of the substrate film was prevented. This back-side discharge was suppressed by supplying nitrogen gas to the back-side of the substrate film.

AB - A novel roll-to-roll deposition method, namely, "through-substrate plane-plate dielectric-barrier discharge," was developed. This method uses a dielectric-barrier-discharge plasma plate, which has antenna and ground lines in a dielectric material, as an electrode. A film substrate was placed on the electrode so that an electric field, which passes through the substrate, generates a plasma above surface of the substrate. This method can avoid unexpected deposition on the electrode, which causes dust-particle contamination. In a preliminary experiment, deposition rates of Si, SiN, and Diamond-Like-Carbon were about 1, 1.5 and 5 μm/min, respectively. When there was a space between the plasma plate and the substrate film, plasma was generated on the back side of the substrate film, and then the deposition on the surface of the substrate film was prevented. This back-side discharge was suppressed by supplying nitrogen gas to the back-side of the substrate film.

UR - http://www.scopus.com/inward/record.url?scp=84881064649&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84881064649&partnerID=8YFLogxK

U2 - 10.1088/1742-6596/441/1/012024

DO - 10.1088/1742-6596/441/1/012024

M3 - Article

AN - SCOPUS:84881064649

VL - 441

JO - Journal of Physics: Conference Series

JF - Journal of Physics: Conference Series

SN - 1742-6588

IS - 1

M1 - 012024

ER -