Deposition of Through-Hole Metal Film on Glass with Electroless Plating

Fumio Nakamaru, Yoshinori Matsumoto

Research output: Contribution to journalArticle

Abstract

Good adhesive nickel film was deposited on a glass substrate with electroless nickel plating and photolithography technique. Line-and-space metal patterns were deposited on the glass substrate and the resolution was approximately 20|m. Through holes on a 500|m-thickness glass substrate were fabricated by sandblast method, and the holes were metalized by using dry-film and the plating. Connection yield was 100% in 4cm2 glass substrate, and the resistance of the through-hole was less than 0.05Ω. Keywords : glass substrate, electorless plating, adherence, through hole, photolithography.

Original languageEnglish
Pages (from-to)313-314
Number of pages2
JournalIEEJ Transactions on Sensors and Micromachines
Volume123
Issue number8
DOIs
Publication statusPublished - 2003

Fingerprint

Electroless plating
Glass
Substrates
Metals
Photolithography
Plating
Nickel plating
Adhesives
Nickel

Keywords

  • adherence
  • electorless plating
  • glass substrate
  • photolithography
  • through hole

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Deposition of Through-Hole Metal Film on Glass with Electroless Plating. / Nakamaru, Fumio; Matsumoto, Yoshinori.

In: IEEJ Transactions on Sensors and Micromachines, Vol. 123, No. 8, 2003, p. 313-314.

Research output: Contribution to journalArticle

@article{80433c719fba47c986e8e9b5f4834f1a,
title = "Deposition of Through-Hole Metal Film on Glass with Electroless Plating",
abstract = "Good adhesive nickel film was deposited on a glass substrate with electroless nickel plating and photolithography technique. Line-and-space metal patterns were deposited on the glass substrate and the resolution was approximately 20|m. Through holes on a 500|m-thickness glass substrate were fabricated by sandblast method, and the holes were metalized by using dry-film and the plating. Connection yield was 100{\%} in 4cm2 glass substrate, and the resistance of the through-hole was less than 0.05Ω. Keywords : glass substrate, electorless plating, adherence, through hole, photolithography.",
keywords = "adherence, electorless plating, glass substrate, photolithography, through hole",
author = "Fumio Nakamaru and Yoshinori Matsumoto",
year = "2003",
doi = "10.1541/ieejsmas.123.313",
language = "English",
volume = "123",
pages = "313--314",
journal = "IEEJ Transactions on Sensors and Micromachines",
issn = "1341-8939",
publisher = "The Institute of Electrical Engineers of Japan",
number = "8",

}

TY - JOUR

T1 - Deposition of Through-Hole Metal Film on Glass with Electroless Plating

AU - Nakamaru, Fumio

AU - Matsumoto, Yoshinori

PY - 2003

Y1 - 2003

N2 - Good adhesive nickel film was deposited on a glass substrate with electroless nickel plating and photolithography technique. Line-and-space metal patterns were deposited on the glass substrate and the resolution was approximately 20|m. Through holes on a 500|m-thickness glass substrate were fabricated by sandblast method, and the holes were metalized by using dry-film and the plating. Connection yield was 100% in 4cm2 glass substrate, and the resistance of the through-hole was less than 0.05Ω. Keywords : glass substrate, electorless plating, adherence, through hole, photolithography.

AB - Good adhesive nickel film was deposited on a glass substrate with electroless nickel plating and photolithography technique. Line-and-space metal patterns were deposited on the glass substrate and the resolution was approximately 20|m. Through holes on a 500|m-thickness glass substrate were fabricated by sandblast method, and the holes were metalized by using dry-film and the plating. Connection yield was 100% in 4cm2 glass substrate, and the resistance of the through-hole was less than 0.05Ω. Keywords : glass substrate, electorless plating, adherence, through hole, photolithography.

KW - adherence

KW - electorless plating

KW - glass substrate

KW - photolithography

KW - through hole

UR - http://www.scopus.com/inward/record.url?scp=85009535646&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85009535646&partnerID=8YFLogxK

U2 - 10.1541/ieejsmas.123.313

DO - 10.1541/ieejsmas.123.313

M3 - Article

VL - 123

SP - 313

EP - 314

JO - IEEJ Transactions on Sensors and Micromachines

JF - IEEJ Transactions on Sensors and Micromachines

SN - 1341-8939

IS - 8

ER -