Design and analysis for ThruChip design for manufacturing (DFM)

Li Chung Hsu, Yasuhiro Take, Atsutake Kosuge, So Hasegawa, Junichiro Kadamoto, Tadahiro Kuroda

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

A 1GB/s ThruChip interface (TCI) test chip for wafer thinning, power mesh, and dummy metal fill impacts are analyzed and evaluated with test chip measurement and field solver simulation. The measurement results show that TCI coil dimension can be sized down as wafer thinning by following D/Z=3 rule. However, the experiment shows 20% power reduction by enlarging TCI coil (D/Z=6). The power mesh lies between TCI coils can dramatically decrease the TCI magnetic pulse strength and hence cause TCI to fail. Dummy metal within TCI coils has no impact on TCI transmission

Original languageEnglish
Title of host publication20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages46-47
Number of pages2
ISBN (Electronic)9781479977925
DOIs
Publication statusPublished - 2015 Mar 11
Event2015 20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015 - Chiba, Japan
Duration: 2015 Jan 192015 Jan 22

Publication series

Name20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015

Other

Other2015 20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015
CountryJapan
CityChiba
Period15/1/1915/1/22

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ASJC Scopus subject areas

  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Control and Systems Engineering
  • Modelling and Simulation

Cite this

Hsu, L. C., Take, Y., Kosuge, A., Hasegawa, S., Kadamoto, J., & Kuroda, T. (2015). Design and analysis for ThruChip design for manufacturing (DFM). In 20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015 (pp. 46-47). [7058979] (20th Asia and South Pacific Design Automation Conference, ASP-DAC 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASPDAC.2015.7058979