Design of transceiver circuits for NRZ signaling in inductive inter-chip wireless superconnect

Daisuke Mizoguchi, Noriyuki Miura, Mari Inoue, Tadahiro Kuroda

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    Recently, A 3-dimensional integrated circuits (3D-ICs) are appeared for high density packaging. High speed interconnection is expected in 3D-ICs. A wireless bus for stacked chips is presented in this paper. The interface utilizes inductive coupling with metal spiral inductors. Transceiver circuits for Non-Return-to-Zero (NRZ) signaling were developed to reduce the power and achieve high data rate. Receiver circuit's timing margin and sensitivity is discussed. Test chip was fabricated and timing margin was measured. The result agrees very well with simulation. Then crosstalk reduction techniques for channel array are proposed and its efficiency is demonstrated by test chip. The chip has 3x65 channel array, each channel's performance is IGbps, and maximum data rate of 195Gbps are achieved by using proposed cross talk reduction techniques.

    Original languageEnglish
    Title of host publication2005 International Conference on Integrated Circuit Design and Technology, ICICDT
    Pages56-61
    Number of pages6
    Publication statusPublished - 2005 Oct 10
    Event2005 International Conference on Integrated Circuit Design and Technology, ICICDT - Austin, TX, United States
    Duration: 2005 May 92005 May 11

    Publication series

    Name2005 International Conference on Integrated Circuit Design and Technology, ICICDT

    Other

    Other2005 International Conference on Integrated Circuit Design and Technology, ICICDT
    CountryUnited States
    CityAustin, TX
    Period05/5/905/5/11

    ASJC Scopus subject areas

    • Engineering(all)

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  • Cite this

    Mizoguchi, D., Miura, N., Inoue, M., & Kuroda, T. (2005). Design of transceiver circuits for NRZ signaling in inductive inter-chip wireless superconnect. In 2005 International Conference on Integrated Circuit Design and Technology, ICICDT (pp. 56-61). (2005 International Conference on Integrated Circuit Design and Technology, ICICDT).