Abstract
Polishing technology has provided the possibility of obtaining super smooth surfaces on semiconductor and other brittle materials for electronic and optical applications. In this study, a new manufacturing method for a polishing disc with fixed fine abrasive grains is proposed. This manufacturing method consists of three main processes. In the first process, an undiluted solution of abrasives is produced by adding some sodium alginate into the solution in which fine abrasive grains of SiO2, Al2O3 and Cr2O3 are dispersed. Next, by dropping the undiluted abrasive solution into a lactic acid calcium solution, the fine abrasive grains are granulated into spheres having diameters of 2-3 mm. In the second process, the granulated spheres are combined using the same undiluted abrasive solution as a binder. In the last process, the combined body of granulation spheres is dried up and formed by a lathe. The polishing disc produced by this method has a bulk density of 0.5 g/cm3, a Vickers hardness less than HV10. Observations using a scanning electron microscope show that the polishing disc has a high-density and homogeneous structure and the bonding strength is low. Experimental results indicate that the developed polishing disc can be used in high efficiency polishing for silicon wafers.
| Original language | English |
|---|---|
| Pages (from-to) | 257-262 |
| Number of pages | 6 |
| Journal | Key Engineering Materials |
| Volume | 238-239 |
| Publication status | Published - 2003 |
| Externally published | Yes |
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Keywords
- Fixed abrasive
- Granulated fine abrasive
- Polishing
- Polishing disc
- Silicon wafer
ASJC Scopus subject areas
- Ceramics and Composites
- Chemical Engineering (miscellaneous)
Cite this
Development of a polishing disc containing granulated fine abrasives. / Nakamura, H.; Yan, Jiwang; Syoji, K.; Wakamatsu, Y.
In: Key Engineering Materials, Vol. 238-239, 2003, p. 257-262.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Development of a polishing disc containing granulated fine abrasives
AU - Nakamura, H.
AU - Yan, Jiwang
AU - Syoji, K.
AU - Wakamatsu, Y.
PY - 2003
Y1 - 2003
N2 - Polishing technology has provided the possibility of obtaining super smooth surfaces on semiconductor and other brittle materials for electronic and optical applications. In this study, a new manufacturing method for a polishing disc with fixed fine abrasive grains is proposed. This manufacturing method consists of three main processes. In the first process, an undiluted solution of abrasives is produced by adding some sodium alginate into the solution in which fine abrasive grains of SiO2, Al2O3 and Cr2O3 are dispersed. Next, by dropping the undiluted abrasive solution into a lactic acid calcium solution, the fine abrasive grains are granulated into spheres having diameters of 2-3 mm. In the second process, the granulated spheres are combined using the same undiluted abrasive solution as a binder. In the last process, the combined body of granulation spheres is dried up and formed by a lathe. The polishing disc produced by this method has a bulk density of 0.5 g/cm3, a Vickers hardness less than HV10. Observations using a scanning electron microscope show that the polishing disc has a high-density and homogeneous structure and the bonding strength is low. Experimental results indicate that the developed polishing disc can be used in high efficiency polishing for silicon wafers.
AB - Polishing technology has provided the possibility of obtaining super smooth surfaces on semiconductor and other brittle materials for electronic and optical applications. In this study, a new manufacturing method for a polishing disc with fixed fine abrasive grains is proposed. This manufacturing method consists of three main processes. In the first process, an undiluted solution of abrasives is produced by adding some sodium alginate into the solution in which fine abrasive grains of SiO2, Al2O3 and Cr2O3 are dispersed. Next, by dropping the undiluted abrasive solution into a lactic acid calcium solution, the fine abrasive grains are granulated into spheres having diameters of 2-3 mm. In the second process, the granulated spheres are combined using the same undiluted abrasive solution as a binder. In the last process, the combined body of granulation spheres is dried up and formed by a lathe. The polishing disc produced by this method has a bulk density of 0.5 g/cm3, a Vickers hardness less than HV10. Observations using a scanning electron microscope show that the polishing disc has a high-density and homogeneous structure and the bonding strength is low. Experimental results indicate that the developed polishing disc can be used in high efficiency polishing for silicon wafers.
KW - Fixed abrasive
KW - Granulated fine abrasive
KW - Polishing
KW - Polishing disc
KW - Silicon wafer
UR - http://www.scopus.com/inward/record.url?scp=0037285388&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0037285388&partnerID=8YFLogxK
M3 - Article
VL - 238-239
SP - 257
EP - 262
JO - Key Engineering Materials
JF - Key Engineering Materials
SN - 1013-9826
ER -