Development of damage assessment package for building with isolation system and its application to 2011 Tohoku Earthquake

Akira Mita, Ken Ichimura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We developed a damage assessment package to assess buildings with various isolation systems. The package provides seven items to be used for damage assessment based on ARX method, MOESP method and double integration of acceleration data. The necessary condition for the package is to have a monitoring system with accelerometers at least at three levels i.e. on foundation, isolation layer and on top floor or roof of the building. Using this package, the performance of the isolation systems as well as superstructure during the earthquake can be quantitatively estimated. The package was tested for a 7-story base-isolated building in Yokohama, Japan. The building experienced the 2011 Tohoku Earthquake of the moment magnitude 9.0.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
Volume8345
DOIs
Publication statusPublished - 2012
EventSensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2012 - San Diego, CA, United States
Duration: 2012 Mar 122012 Mar 15

Other

OtherSensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2012
CountryUnited States
CitySan Diego, CA
Period12/3/1212/3/15

    Fingerprint

Keywords

  • ARX
  • Damage assessment
  • Isolation
  • MOESP
  • Structural health monitoring
  • Subspace identification
  • Tohoku Earthquake

ASJC Scopus subject areas

  • Applied Mathematics
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Mita, A., & Ichimura, K. (2012). Development of damage assessment package for building with isolation system and its application to 2011 Tohoku Earthquake. In Proceedings of SPIE - The International Society for Optical Engineering (Vol. 8345). [834539] https://doi.org/10.1117/12.915578