Development of High-Sensitivity Electrically Conductive Composite Elements by Press Molding of Polymer and Carbon Nanofibers

Shunsuke Aikawa, Yugang Zhao, Jiwang Yan

Research output: Contribution to journalArticlepeer-review

Abstract

Carbon nanofibers (CNFs) have various excellent properties, such as high tensile strength, electric conductivity and current density resistance, and thus have great application potential in electrical sensor development. In this research, electrically conductive composite elements using CNFs sandwiched by thermoplastic olefin (TPO) substrates were developed by press molding. The metal mold used for press molding was processed by a femtosecond laser to generate laser-induced periodic surface structures (LIPSS) on the mold surface. The aggregate of CNFs was then flexibly fixed by the LIPSSs imprinted on the TPO substrate surface to produce a wavy conductive path of CNFs. The developed composite elements exhibited a sharp increase in electrical resistance as strain increased. A high gauge factor of over 47 was achieved, which demonstrates high sensitivity against strain when the composite element is used as a strain gauge. Scanning electron microscope observation revealed that the TPO filled the spaces in the aggregate of CNFs after press molding, and the conductive path was extended by the tensile strain. The strain-induced dynamic changes of contact states of CNFs and CNFs networks are discussed based on the electrical performance measurement and cross-sectional observation of the elements. This research provides a new approach to the production of flexible and high sensitivity strain sensors.

Original languageEnglish
Article number170
JournalMicromachines
Volume13
Issue number2
DOIs
Publication statusPublished - 2022 Feb

Keywords

  • Carbon nanofibers
  • Conductive composite element
  • Laser-induced periodic surface structure
  • Polymer
  • Press molding
  • Strain sensor

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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