Dexterous Machining of Unstable Thin Plate

Yuya Kida, Kohei Toyoda, Anthony Beaucamp, Yoshimi Takeuchi

Research output: Contribution to journalConference articlepeer-review


In recent years, miniaturization and light weightedness are required for industrial products as well as high functionality. Thin plates are appropriate in terms of weight, however they are usually difficult to produce only by cutting operation due to the deformation by cutting force or vibration of the thin plate. This study deals with the machining of a twisted thin plate, whose height, width and thickness are 50 mm, 30 mm and 0.1 mm respectively, without using any auxiliary tool. Such a thin plate with high aspect ratio is easily broken down by the cutting force. Thus, the machining of thin plate with high aspect ratio is approached by devising a tool path strategy in this study. As the cutting force easily allows for deformation of twisted thin plate with high aspect ratio, two methods are devised with regard to the generation of the tool path, the method with a supporting frame and the peeling method so that the stiffness of the plate can be kept high. Then, the actual machining of thin plate with high aspect ratio, made of aluminum alloy, was realized without any breakage. As a result, it is found that such cutting method allows the possibility of fabricating such a twisted thin plate.

Original languageEnglish
Pages (from-to)324-329
Number of pages6
JournalProcedia CIRP
Publication statusPublished - 2017
Externally publishedYes
Event50th CIRP Conference on Manufacturing Systems, CIRP CMS 2017 - Taichung, Taiwan, Province of China
Duration: 2017 May 32017 May 5


  • Dexterous machining
  • High aspect ratio
  • Twisted thin plate

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Industrial and Manufacturing Engineering


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