Dry etching and low-temperature direct bonding process of lithium niobate wafer for fabricating micro/nano channel device

Toshiyuki Tsuchiya, Koji Sugano, Hideki Takahashi, Hangyeol Seo, Yuriy Pihosh, Yutaka Kazoe, Kazuma Mawatari, Takehiko Kitamori, Osamu Tabata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

We have developed dry etching process of lithium niobate (LN) wafer using neutral loop discharge reactive ion etching (NLD-RIE) to fabricate both micro- and nano-channels for investigating proton diffusion enhancement in ferroelectric nanochannels. We have also developed low-temperature direct bonding process between LN wafers. Two-hundred parallel nanochannel array of 200-nm deep and wide and 400-μm long connected to two microchannels (width: 500 μm, depth: 5.9 μm) at the both ends were fabricated. We have succeeded in measuring the proton diffusion coefficient as high as 1.2×10-8 m2/s.

Original languageEnglish
Title of host publicationTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1245-1248
Number of pages4
ISBN (Electronic)9781538627310
DOIs
Publication statusPublished - 2017 Jul 26
Event19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017 - Kaohsiung, Taiwan, Province of China
Duration: 2017 Jun 182017 Jun 22

Publication series

NameTRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems

Other

Other19th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2017
CountryTaiwan, Province of China
CityKaohsiung
Period17/6/1817/6/22

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Keywords

  • Lithium niobate
  • magnetic neutral loop discharge reactive ion etching
  • nanochannel
  • proton diffusion
  • surface activated bonding

ASJC Scopus subject areas

  • Chemical Health and Safety
  • Instrumentation
  • Electrical and Electronic Engineering

Cite this

Tsuchiya, T., Sugano, K., Takahashi, H., Seo, H., Pihosh, Y., Kazoe, Y., Mawatari, K., Kitamori, T., & Tabata, O. (2017). Dry etching and low-temperature direct bonding process of lithium niobate wafer for fabricating micro/nano channel device. In TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 1245-1248). [7994281] (TRANSDUCERS 2017 - 19th International Conference on Solid-State Sensors, Actuators and Microsystems). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TRANSDUCERS.2017.7994281