Effect of cutting edge truncation on ground surface morphology of hard and brittle materials for optical devices

X. Kang, J. Tamaki, A. Kubo, Jiwang Yan, T. Iyama

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

For the purpose of investigating the effect of cutting edge truncation on ground surface morphology, several kinds of hard and brittle materials used for optical devices, borosilicate glass, glass quartz, crystal quartz and sapphire, are plunge ground with a SD600 metal-bonded grinding wheel, the cutting edges of which are truncated so as to be aligned with the height level of the grinding wheel working surface, after electrocontact discharge truing and dressing. It is found that an improvement of roughness can be obtained for every material investigated, although the degree of roughness improvement depends on the kind of material. Ductile-mode grinding is most likely to be realized in the case of crystal quartz.

Original languageEnglish
Pages (from-to)139-144
Number of pages6
JournalKey Engineering Materials
Volume291-292
Publication statusPublished - 2005
Externally publishedYes

Fingerprint

Quartz
Brittleness
Optical devices
Surface morphology
Grinding wheels
Surface roughness
Crystals
Borosilicate glass
Aluminum Oxide
Sapphire
Metals
Glass

Keywords

  • Borosilicate glass
  • Crystal quartz
  • Cutting edge truncation
  • Ductile-mode grinding
  • Glass quartz
  • Metal-bonded grinding wheel
  • Sapphire
  • Surface morphology

ASJC Scopus subject areas

  • Ceramics and Composites
  • Chemical Engineering (miscellaneous)
  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Effect of cutting edge truncation on ground surface morphology of hard and brittle materials for optical devices. / Kang, X.; Tamaki, J.; Kubo, A.; Yan, Jiwang; Iyama, T.

In: Key Engineering Materials, Vol. 291-292, 2005, p. 139-144.

Research output: Contribution to journalArticle

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