Effect of cutting edge truncation on ground surface morphology of hard and brittle materials for optical devices

X. Kang, J. Tamaki, A. Kubo, J. Yan, T. Iyama

Research output: Chapter in Book/Report/Conference proceedingChapter

Abstract

For the purpose of investigating the effect of cutting edge truncation on ground surface morphology, several kinds of hard and brittle materials used for optical devices, borosilicate glass, glass quartz, crystal quartz and sapphire, are plunge ground with a SD600 metal-bonded grinding wheel, the cutting edges of which are truncated so as to be aligned with the height level of the grinding wheel working surface, after electrocontact discharge truing and dressing. It is found that an improvement of roughness can be obtained for every material investigated, although the degree of roughness improvement depends on the kind of material. Ductile-mode grinding is most likely to be realized in the case of crystal quartz.

Original languageEnglish
Title of host publicationKey Engineering Materials
PublisherTrans Tech Publications Ltd
Pages139-144
Number of pages6
ISBN (Print)9780878499748
DOIs
Publication statusPublished - 2005
Externally publishedYes

Publication series

NameKey Engineering Materials
Volume291-292
ISSN (Print)1013-9826
ISSN (Electronic)1662-9795

Keywords

  • Borosilicate glass
  • Crystal quartz
  • Cutting edge truncation
  • Ductile-mode grinding
  • Glass quartz
  • Metal-bonded grinding wheel
  • Sapphire
  • Surface morphology

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Effect of cutting edge truncation on ground surface morphology of hard and brittle materials for optical devices'. Together they form a unique fingerprint.

Cite this