Effect of intermetallic compound layer development on interfacial strength of solder joints

Masaki Omiya, Kikuo Kishimoto, Toshikazu Shibuya, Masazumi Amagai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Recently, preventing environmental pollutions, lead-free (Pb-free) solders are widely used instead of conventional lead-tin(Pb-Sn) eutectic solders. However, the mechanical properties of Pb-free solders have not been clarified. Intermetallic compounds are formed during reflow process between solder and electrical pads and gradually grow in service. Due to it's brittle manner, the reliability of solder joints are supposed to degenerate. By using the Cu-plates on which Cu or Ni or Ni+Au plating was deposited, and Pb-free solders (Sn-Ag-Cu solders), the specimen of solder joints were fabricated. After aging it in an isothermal chamber, tensile tests were performed and the relations between solder joint strength and aging period were considered. From SEM microscope observation and EDX microprobe analysis, the growth and components of the intermetallic compounds layer were also examined.

Original languageEnglish
Title of host publicationAdvances in Electronic Packaging
Pages1157-1164
Number of pages8
Volume2
Publication statusPublished - 2001
Externally publishedYes
EventPacific Rim/International , Intersociety Electronic Packaging Technical/Business Conference and Exhibition - Kauai, Hi, United States
Duration: 2001 Jul 82001 Jul 13

Other

OtherPacific Rim/International , Intersociety Electronic Packaging Technical/Business Conference and Exhibition
CountryUnited States
CityKauai, Hi
Period01/7/801/7/13

Fingerprint

Soldering alloys
Intermetallics
Aging of materials
Plating
Eutectics
Tin
Energy dispersive spectroscopy
Pollution
Microscopes
Lead
Mechanical properties
Scanning electron microscopy
Lead-free solders

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering

Cite this

Omiya, M., Kishimoto, K., Shibuya, T., & Amagai, M. (2001). Effect of intermetallic compound layer development on interfacial strength of solder joints. In Advances in Electronic Packaging (Vol. 2, pp. 1157-1164)

Effect of intermetallic compound layer development on interfacial strength of solder joints. / Omiya, Masaki; Kishimoto, Kikuo; Shibuya, Toshikazu; Amagai, Masazumi.

Advances in Electronic Packaging. Vol. 2 2001. p. 1157-1164.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Omiya, M, Kishimoto, K, Shibuya, T & Amagai, M 2001, Effect of intermetallic compound layer development on interfacial strength of solder joints. in Advances in Electronic Packaging. vol. 2, pp. 1157-1164, Pacific Rim/International , Intersociety Electronic Packaging Technical/Business Conference and Exhibition, Kauai, Hi, United States, 01/7/8.
Omiya M, Kishimoto K, Shibuya T, Amagai M. Effect of intermetallic compound layer development on interfacial strength of solder joints. In Advances in Electronic Packaging. Vol. 2. 2001. p. 1157-1164
Omiya, Masaki ; Kishimoto, Kikuo ; Shibuya, Toshikazu ; Amagai, Masazumi. / Effect of intermetallic compound layer development on interfacial strength of solder joints. Advances in Electronic Packaging. Vol. 2 2001. pp. 1157-1164
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