Effect of nanoscale surface roughness on the bonding energy of direct-bonded silicon wafers

N. Miki, S. M. Spearing

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The effect of surface roughness at the nanoscale on direct-wafer bond quality was investigated. The bond quality was evaluated by measurement of the effective bonding energy. It was shown that the experimental results revealed a clear correlation between the bonding energy and the bearing ratio. It was found that a bearing depth of ∼1.4 nm is appropriate for the characterization of direct-bonded silicon at room temperature.

Original languageEnglish
Pages (from-to)6800-6806
Number of pages7
JournalJournal of Applied Physics
Issue number10
Publication statusPublished - 2003 Nov 15
Externally publishedYes


ASJC Scopus subject areas

  • Physics and Astronomy(all)

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