Effect of Ni plating thickness on fatigue failure of lead-free solder joints

Masaki Omiya, Takeshi Miyazaki, Hirotsugu Inoue, Kikuo Kishimoto, Masazumi Amagai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The purpose of this paper is to study the effect of nickel plating thickness on fatigue failure of lead-free solder joints after thermal aging. Cyclic three-point bending tests were carried out and investigate the relationships between intermetallic compound(IMC) layer development and the fatigue life of solder joints. After the fatigue tests, crosssections of solder joint were observed by scanning electron microscope(SEM) and crack propagation paths were investigated. The results show that when the thickness of nickel plating layer is too thin, voids in solder were observed and the fatigue life of solder joints were short. On the other hands, when the thickness of nickel plating layer is too thick, thick IMC layers were formed between solder and plating layers and developed after thermal aging. The optimum thickness of nickel plating layer in this study was 0.08 or 0.12 pim. In these cases, the nickel layer diffused into the solder and was consumed completely to form IMC layer during reflow process. Then, the development of IMC layer was not occurred and good fatigue strengths were obtained.

Original languageEnglish
Title of host publication2006 International Conference on Electronic Materials and Packaging, EMAP
DOIs
Publication statusPublished - 2006
Externally publishedYes
Event2006 International Conference on Electronic Materials and Packaging, EMAP - Kowloon, China
Duration: 2006 Dec 112006 Dec 14

Other

Other2006 International Conference on Electronic Materials and Packaging, EMAP
CountryChina
CityKowloon
Period06/12/1106/12/14

Fingerprint

Plating
Soldering alloys
Nickel plating
Fatigue of materials
Intermetallics
Thermal aging
Bending tests
Lead-free solders
Crack propagation
Electron microscopes
Nickel
Scanning

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Omiya, M., Miyazaki, T., Inoue, H., Kishimoto, K., & Amagai, M. (2006). Effect of Ni plating thickness on fatigue failure of lead-free solder joints. In 2006 International Conference on Electronic Materials and Packaging, EMAP [4430655] https://doi.org/10.1109/EMAP.2006.4430655

Effect of Ni plating thickness on fatigue failure of lead-free solder joints. / Omiya, Masaki; Miyazaki, Takeshi; Inoue, Hirotsugu; Kishimoto, Kikuo; Amagai, Masazumi.

2006 International Conference on Electronic Materials and Packaging, EMAP. 2006. 4430655.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Omiya, M, Miyazaki, T, Inoue, H, Kishimoto, K & Amagai, M 2006, Effect of Ni plating thickness on fatigue failure of lead-free solder joints. in 2006 International Conference on Electronic Materials and Packaging, EMAP., 4430655, 2006 International Conference on Electronic Materials and Packaging, EMAP, Kowloon, China, 06/12/11. https://doi.org/10.1109/EMAP.2006.4430655
Omiya M, Miyazaki T, Inoue H, Kishimoto K, Amagai M. Effect of Ni plating thickness on fatigue failure of lead-free solder joints. In 2006 International Conference on Electronic Materials and Packaging, EMAP. 2006. 4430655 https://doi.org/10.1109/EMAP.2006.4430655
Omiya, Masaki ; Miyazaki, Takeshi ; Inoue, Hirotsugu ; Kishimoto, Kikuo ; Amagai, Masazumi. / Effect of Ni plating thickness on fatigue failure of lead-free solder joints. 2006 International Conference on Electronic Materials and Packaging, EMAP. 2006.
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