Effects of target compliance on a high-speed droplet impact

Toshiyuki Sanada, Keita Ando, Tim Colonius

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

High speed spray cleaning which utilize droplets impact has been used for removing contaminants from wafer surface. When a droplet impacts a solid surface at high speed, the contact periphery expands very quickly and liquid compressibility plays an important role in the initial dynamics and the formation of lateral jets. Impact results in high pressures that can clean or damage the surface. In this study, we numerically investigated a high speed droplet impacts on a solid wall. In order to compare the available theory and experiments, 1D, 2D and axisymmetric solutions are obtained. The generated pressures, shock speeds, and the lateral jetting mechanism are investigated; especially the effect of target compliance is focused.

Original languageEnglish
Title of host publicationUltra Clean Processing of Semiconductor Surfaces X
PublisherTrans Tech Publications Ltd
Pages137-140
Number of pages4
ISBN (Print)9783037853887
DOIs
Publication statusPublished - 2012 Jan 1
Externally publishedYes
Event10th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2010 - Ostend, Belgium
Duration: 2010 Sep 202010 Sep 22

Publication series

NameSolid State Phenomena
Volume187
ISSN (Print)1012-0394

Other

Other10th International Symposium on Ultra Clean Processing of Semiconductor Surfaces, UCPSS 2010
CountryBelgium
CityOstend
Period10/9/2010/9/22

Keywords

  • High-speed droplet impact
  • Numerical simulation
  • Side jet
  • Target compliance

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

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  • Cite this

    Sanada, T., Ando, K., & Colonius, T. (2012). Effects of target compliance on a high-speed droplet impact. In Ultra Clean Processing of Semiconductor Surfaces X (pp. 137-140). (Solid State Phenomena; Vol. 187). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/SSP.187.137